Manufacturing method for devices

Abstract

The invention provides a method of manufacturing a device, which can produce the devices divided into pieces with adhesive membrane on the rear and without damage, even if the thickness of thin wafer is below 100 mum. The provided device manufacturing method divides the wafer which forms devices on the surface and has a thickness of below 100 mum along the preset parting line, and installs the adhesive membrane for welding the tube core on the surface of the device. The method includes: wafer supporting procedure, installing the adhesive membrane on the surface of the wafer and adhering the adhesive membrane on the surface of the parting band; laser processing procedure, irradiating the wafer by the pulse laser ray with absorptive wavelength along the preset parting line of the wafer, parting the wafer off devices and cutting off the adhesive membrane; and picking procedure, after the laser processing procedure, expanding the parting band, expanding the gas between the parted devices, peeling off the devices with the adhesive membrane on the rear from the parting band, and picking.

Description

technical field [0001] The present invention relates to a method of manufacturing a device, which divides a wafer into individual devices along a planned division line, and mounts an adhesive film for die bonding on the back surface of each device, wherein the wafer is divided into lattice-shaped divisions on the surface. Devices are formed in a plurality of regions divided by predetermined lines. Background technique [0002] For example, in the manufacturing process of a semiconductor device, on the surface of a substantially disk-shaped semiconductor wafer, IC (Integrated Circuit : integrated circuit), LSI (large scale integration: large-scale integrated circuit) and other devices, each device is manufactured by dividing each region in which the device is formed along a dividing line. As a dividing device for dividing a semiconductor wafer, a cutting device called a dicing device that cuts a semiconductor wafer along a planned dividing line with a cutting blade having a ...

AI Technical Summary

Problems solved by technology

[0005] However, if the thickness of the wafer is as thin as 100 μm or less, when the adhesive film is attached to the back surface of the wafer and cut with a cutting tool, the cut off device may bounce on the adhesive film and be damaged by the impact of the cutting tool rotating at high speed. broken problem

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