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Image sensing wafer packaging structure and encapsulation method thereof

A technology of image sensing and chip packaging, applied in image communication, radiation control devices, televisions, etc., can solve the problems of multiple raw materials, dust pollution, and large dust surface, so as to improve production yield, occupy less space, and reduce costs Effect

Inactive Publication Date: 2008-10-15
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, the packaging volume of the camera module 100 will be larger
At the same time, because the lens module 10 needs to consume more raw materials, the packaging cost of the camera module 100 is increased.
[0006] In addition, because the space enclosed by the substrate 13 and the transparent glass 18 where the image sensing chip 15 is located is relatively large, the surface of the dust generated by it is also relatively large, and the sensing area 151 is more easily polluted by dust, resulting in The production yield of the image sensor chip is reduced

Method used

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  • Image sensing wafer packaging structure and encapsulation method thereof
  • Image sensing wafer packaging structure and encapsulation method thereof
  • Image sensing wafer packaging structure and encapsulation method thereof

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Embodiment Construction

[0020] The present invention will be further described in detail below in conjunction with the accompanying drawings.

[0021] see figure 2 , is the image sensing chip packaging structure according to the first embodiment of the present invention, which includes a substrate 20 , an image sensing chip 22 , a first adhesive 23 , a second adhesive 29 and a cover 26 .

[0022] The substrate 20 can be made of fiberglass, reinforced plastic or ceramics, and has a bottom plate 210 , and a plurality of substrate pads 201 are disposed around the edge of the bottom plate 210 . The image sensing chip 22 is adhered on the bottom plate 210 by a second adhesive 29 .

[0023] The image sensing chip 22 has a sensing area 223 and a non-sensing area 224 surrounding the sensing area, and a plurality of chip bonding pads 221 are disposed on the edge of the non-sensing area 224 .

[0024] The package structure of the image sensing chip also includes a plurality of leads 24, the plurality of lea...

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Abstract

The invention provides an encapsulating structure of an image sensing chip, which comprises a substrate, a piece of image sensing chip, a cover body and mucilage glue, wherein, the substrate is used for loading the image sensing chip which is provided with a sensing area and a non-sensing area which surrounds the sensing area; the cover body is a curved imaging lens used for leading image signal light to forming image in the sensing area of the image sensing chip; the cover body is fixedly arranged on the image sensing chip by the mucilage glue arranged on the non-sensing area of the image sensing chip. The image sensing chip of the invention not only has small encapsulating structure volume which can save encapsulating cost, but also can effectively reduce the pollution of dust to the image sensing chip, thus enhancing the yield of the product. Moreover, the invention also relates to an encapsulating method of the image sensing chip.

Description

technical field [0001] The invention relates to the packaging of image sensing chips, in particular to a packaging structure and packaging method for small-sized image sensing chips. Background technique [0002] With the continuous development of science and technology, portable electronic devices such as mobile phones are widely used and tend to be light, beautiful and multi-functional. The camera function is an additional function of the popular mobile phones in recent years. A camera module used in a mobile phone must not only have high photographic performance, but also meet the requirements of thinness, lightness and compactness. The packaging volume of the image sensing chip is one of the main factors determining the size of the camera module. Therefore, improving the packaging structure and packaging method of the image sensing chip will be beneficial to the miniaturization and weight reduction of the camera module. [0003] Such as figure 1 The packaging structure...

Claims

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Application Information

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IPC IPC(8): H01L27/146H01L23/04H01L21/50H04N5/225H04N5/335
CPCH01L27/14618H04N5/2253H04N5/2257H01L2224/48091H01L2224/73265H04N23/57H04N23/54H01L2924/00014
Inventor 吴英政
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD