Photopolymerizable silicone materials forming semipermeable membranes for sensor applications
A polysiloxane and sensor technology, applied in the direction of analyzing materials, material electrochemical variables, instruments, etc., can solve the problems of increasing process complexity and cost, and decreasing device yield.
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Embodiment 1
[0098] Samples were prepared by combining 30% TPhT methacrylate silicone resin, 68% PGEMA solvent, and 2% IRGACURE819. The samples were spin-coated onto silicon wafers as films with a thickness of 1 micron. The film was exposed to broadband ultraviolet (UV) radiation of 1000 mJ / cm2 through a photomask and immediately developed with a 1,3,5-trimethylbenzene solvent. A negative tone image of the resulting photomask was etched into the resulting patterned film.
Embodiment 2
[0099] A sample was prepared by combining 71% vinyl functional silicone resin and 29% SiH functional polydimethylsiloxane dissolved in heptane. To this was added 10 ppm platinum acetylacetonate. Spin coat samples on silicon wafers. The film was then exposed to UV radiation at 200 mJ / cm2 through a photomask, followed by heating to 140°C for 10 minutes. The resulting exposed film was washed with toluene to remove non-crosslinked portions of the film. This results in a negative image of the photomask pattern etched into the resulting patterned film.
[0100] The present invention may be used to fabricate sensor devices using wafer-level packaging methods. Methods of the present invention can be used in sensing devices to form permeation-selective layers, analyte-attenuating layers, or both. The transmission-selective layer may be formed in the device prior to dicing the wafer (which may form the substrate).
[0101] FIG. 1 shows a cross-section of a portion of a sensor device. ...
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Abstract
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