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Photopolymerizable silicone materials forming semipermeable membranes for sensor applications

A polysiloxane and sensor technology, applied in the direction of analyzing materials, material electrochemical variables, instruments, etc., can solve the problems of increasing process complexity and cost, and decreasing device yield.

Inactive Publication Date: 2008-10-15
DOW CORNING CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These process steps for patterning polysiloxane-based materials add complexity and cost to the process, require several material handling steps, and often prove to be a source of reduced device yield

Method used

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  • Photopolymerizable silicone materials forming semipermeable membranes for sensor applications
  • Photopolymerizable silicone materials forming semipermeable membranes for sensor applications
  • Photopolymerizable silicone materials forming semipermeable membranes for sensor applications

Examples

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Embodiment 1

[0098] Samples were prepared by combining 30% TPhT methacrylate silicone resin, 68% PGEMA solvent, and 2% IRGACURE819. The samples were spin-coated onto silicon wafers as films with a thickness of 1 micron. The film was exposed to broadband ultraviolet (UV) radiation of 1000 mJ / cm2 through a photomask and immediately developed with a 1,3,5-trimethylbenzene solvent. A negative tone image of the resulting photomask was etched into the resulting patterned film.

Embodiment 2

[0099] A sample was prepared by combining 71% vinyl functional silicone resin and 29% SiH functional polydimethylsiloxane dissolved in heptane. To this was added 10 ppm platinum acetylacetonate. Spin coat samples on silicon wafers. The film was then exposed to UV radiation at 200 mJ / cm2 through a photomask, followed by heating to 140°C for 10 minutes. The resulting exposed film was washed with toluene to remove non-crosslinked portions of the film. This results in a negative image of the photomask pattern etched into the resulting patterned film.

[0100] The present invention may be used to fabricate sensor devices using wafer-level packaging methods. Methods of the present invention can be used in sensing devices to form permeation-selective layers, analyte-attenuating layers, or both. The transmission-selective layer may be formed in the device prior to dicing the wafer (which may form the substrate).

[0101] FIG. 1 shows a cross-section of a portion of a sensor device. ...

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Abstract

A method for preparing sensing devices (biosensors) includes the steps of: (1) applying a photopatternable silicone composition to a surface in a sensing device to form a film, (2) photopatterning the film by a process comprising exposing the film to radiation through a photomask without the use of a photoresist to produce an exposed film; (3) removing regions of the non-exposed film with a developing solvent to form a patterned film, which forms a permselective layer or an analyte attenuation layer covering preselected areas of the sensing device.

Description

Photopolymerizable polysiloxane materials forming semipermeable membranes for sensor applications Cross References to Related Applications According to 35U.S.C. § 119 (e), the application requires the right of priority of the U.S. provisional patent application serial number No.60 / 600449 submitted on August 11, 2004, and the U.S. provisional patent application serial number No. 60 / 600449 is incorporated by reference. technical field [0002] The present invention relates to methods of forming semi-permeable membranes useful as permeation-selective layers and analyte-attenuating layers in sensor devices. The invention further relates to a sensor device comprising the semipermeable membrane. Background technique [0003] Thin film silicone rubbers and polysiloxane-organic copolymers are finding increasing use in a wide range of sensor devices and other microelectronic devices encapsulated using standard semiconductor methods. One group of devices incorporating polysiloxane-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/075C12Q1/00G01N33/543G01N27/40
CPCG03F7/0757C12Q1/002G01N33/5438G01N27/40Y10T428/24802G03F7/2002
Inventor G·B·加德纳S·马格苏迪B·R·哈克尼斯
Owner DOW CORNING CORP