Laser device for cutting

A cutting device and laser technology, applied in the direction of workpiece clamping device, laser welding equipment, metal processing equipment, etc., can solve the problems that cannot meet the needs of high-precision cutting, and the precision of soft board cutting technology is not high, so as to achieve excellent cutting effect, Realize the effect of automation

Active Publication Date: 2008-10-22
HANS CNC SCI & TECH
View PDF0 Cites 47 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the precision of the flexible board cutting technology in the prior ar

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Laser device for cutting
  • Laser device for cutting

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

As shown in FIG. 1 , firstly, the FPC board 7 to be processed is adsorbed on the platform 8 through a vacuum system. The vacuum system includes a workbench panel, a workbench bottom plate, a quick connector, and a vacuum generator. The bottom plate of the workbench is connected with the panel of the workbench by screws, the quick connector is directly installed on the bottom plate of the workbench, the other end of the quick connector is connected to the vacuum nozzle of the vacuum generator through a plastic hose, and the air inlet of the vacuum generator is connected through a plastic hose It is connected to the compressed air in the air circuit. When the compressed air enters the vacuum generator, the air forms a high-speed airflow in the pump body, so it has a stronger suction capacity, so that the FPC board is firmly adsorbed on the platform 8.

As shown in Figure 2, the control flow of the present invention is as follows: before processing, the file of FPC board 7 is impor...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Wavelengthaaaaaaaaaa
Frequencyaaaaaaaaaa
Beam diameteraaaaaaaaaa
Login to view more

Abstract

The invention discloses an FPC (Flexible Printed Circuit) laser cutting device, consisting of a laser focus scanning system, a control system and a vacuum platform system. The cutting device of the invention improves the FPC formation accuracy and saves processing time and cost.

Description

Laser cutting device 【Technical field】 The invention relates to a cutting device, in particular, the invention relates to a laser cutting device for a flexible circuit board. 【technical background】 With the trend of miniaturization of machines and instruments, for example, in industries such as electronics, automobiles, aerospace, and measurement and experimental equipment, the output value of FPC (Flexible Printed Circuit) is increasing. The circuit board is cut and formed, and the traditional method is to stamp it with a mold. However, the precision of mold forming is low, the highest can only be controlled at + / -0.05mm, most of them are at + / -0.10mm, and the circuit is often crushed; and the mold production cycle is long, and it cannot be used universally, and needs to be continuously updated. Not on the pace of research and development. Although there are many laser cutting equipment on the market, none of them can meet the requirements of the precision and cutting q...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B23K26/00B23K26/04B23K26/06B23K26/42B23K26/14B25B11/00B23K26/38B23K26/60B23K26/70
Inventor 高云峰雷群翟学涛巢宏兵林小波
Owner HANS CNC SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap