Sputtering bearing device
A bearing device and sputtering technology, applied in the directions of sputtering, ion implantation, vacuum evaporation, etc., can solve the problem that the temperature of the coated object rises, cannot be dissipated in time, and the heat cannot be dissipated in time, etc. problem, to achieve the effect of lowering the temperature and lowering the temperature
Inactive Publication Date: 2011-11-09
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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Problems solved by technology
[0003] In the continuous sputtering coating process, when the high-energy plasma generated by glow discharge or ion beam is continuously used in a vacuum environment to hit the target, a large amount of heat will be generated, which will increase the temperature in the entire sputtering device, and in the coating At the same time, in order to shorten the coating time, the method of increasing the power is usually adopted, which will further increase the temperature in the entire sputtering device, which will lead to a corresponding increase in the temperature of the coated object
However, the existing continuous sputtering device cannot dissipate heat in time on the carrier platform on which the object to be coated is placed during coating. Therefore, as the temperature in the sputtering device increases, the heat absorbed by the object to be coated cannot be dissipated in time. dispersed
When the temperature in the continuous sputtering device is higher than the thermal deformation temperature of the object to be coated, the object to be coated will be deformed, making the size of the object to be coated exceed the specification requirements, resulting in that the coated object cannot meet the subsequent production needs
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[0010] The sputtering carrying device provided by multiple embodiments of the technical solution will be further described below in conjunction with the accompanying drawings.
[0011] see figure 1 , the sputtering carrier device 100 provided in Embodiment 1 of the present technical solution. The continuous sputtering carrier device 100 includes a heat conducting base 110 , a plurality of bosses 120 and a plurality of cooling fins 130 .
[0012] The heat conducting base 110 has a first surface 112 and a second surface 114 opposite to the first surface 112 . The material of the heat conduction base 110 can be a heat conduction metal, and the heat conduction metal can be selected from gold, silver, copper, aluminum, lead or an alloy formed of two or more of the above metals.
[0013] The plurality of bosses 120 are disposed on the first surface 112 of the heat conduction base 110 , and protrude from the first surface 112 of the heat conduction base 110 in a direction away from...
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The present invention relates to a sputtering bearing device, which comprises a heatconducting pedestal, a plurality of heatconducting bearing parts and a plurality of heat dissipation fins, wherein, the heatconducting pedestal is provided with a first surface and a second surface opposite to the first surface; the a plurality of heatconducting bearing parts are arranged in an array on the first surface of the heatconducting pedestal for bearing a plurality of objects to be coated for sputtering; and the plurality of heat dissipation fins are arranged on the second surface of the heatconducting pedestal. When the sputtering bearing device is used for sputtering, the heat absorbed by an object to be coated can be conducted to the heat dissipation fins for heat dissipation in time, thereby the temperature of the object to be coated can be effectively reduced and the object to be coated can not be deformed due to heating.
Description
technical field [0001] The invention relates to a carrying device, in particular to a sputtering carrying device. Background technique [0002] Sputtering is a thin-film physical vapor deposition technology. The continuous sputtering (In-lineSputtering) coating process has the advantages of fast speed, high output, good coating quality, and strong film adhesion. It has been widely used in various industries. Mass production of various metal and non-metal film layers. [0003] In the continuous sputtering coating process, when the high-energy plasma generated by glow discharge or ion beam is continuously used in a vacuum environment to hit the target, a large amount of heat will be generated, which will increase the temperature in the entire sputtering device, and in the coating At the same time, in order to shorten the coating time, the method of increasing the power is usually adopted, which will further increase the temperature in the entire sputtering device, which will ...
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IPC IPC(8): C23C14/50C23C14/34
Inventor 李汉隆
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD