Detection and package equipment of IC chip

Abstract

The invention relates to an apparatus for detecting and packing integrated circuit chips, and belongs to the field of a semiconductor device manufacturing apparatus. A main track and a conveying belts are arranged among a loading unit, an identification detecting unit, a pin detecting unit, an exchanging area unit, an unqualified area unit, a chip picking and placing unit and a braiding and coiling unit; a belt penetrates through each unit for forming a complete procedure device; the main track is composed of three conveying belts, wherein a first conveying belt and a third conveying belt are arranged on one line, and a second conveying belt is parallel to the other two belt conveying belts; double sliding blocks of the three conveying belts are respectively driven by stepper motors and synchronous pulleys, and the three conveying belts keep uninterrupted transmitting motion along a guide rail for carrying a tray to a requested position along the main track. By integrating the functions of labeling, pin detection and coil packing, the apparatus has the advantages of rapid detection process, high working efficiency, and reasonable and ordered production process, thereby avoiding the backlog or the dislocation of each production procedure and each production link. The apparatus is widely applicable to the detecting and packing field of various integrated circuit chips.

Description

technical field [0001] The invention belongs to the field of methods or equipment for manufacturing or processing semiconductor or solid devices or parts thereof, and in particular relates to a detection and packaging equipment for integrated circuit chips. Background technique [0002] In the semiconductor industry, the packaged integrated circuit chip needs to be effectively detected and packaged before it is used as a patch component; After the standard image is compared, it is detected whether the position is qualified. At the same time, the lead (Leader) of the integrated circuit needs to be compared with the standard image through the three-dimensional visual imaging technology to detect whether the parameters of the lead are qualified. [0003] The sorting process after the inspection is to put the good and bad products into different trays by category. The packaging of the final product is to put the inspected chip from the tray into the tape and roll it. [0004] ...

AI Technical Summary

Problems solved by technology

[0005] At present, most of the machines used for the detection and packaging of integrated circuit chips can only complete one process of detection or packaging, and the production efficiency is low.

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