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Endogenetic Cu6Sn5 granule reinforced leadless compound solder alloy and manufacture method thereof

A particle-reinforced and composite solder technology, applied in metal processing equipment, manufacturing tools, welding equipment, etc., can solve the problem of uneven distribution of reinforced particles, lower solder process performance and reliability, composite solder alloy process performance and mechanical properties General performance reliability and other issues, to achieve the effect of improving shear strength and creep resistance, convenient smelting, and high spheroidizing effect

Inactive Publication Date: 2008-12-17
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the composite solder is prepared by adding reinforcing particles. The reinforcing particles cannot have a good metallurgical reaction with the matrix, and while playing a strengthening role, it will also reduce the process performance and reliability of the solder.
[0008] When the composite solder is prepared by the traditional endogenous method, the distribution of the internal reinforcing particles in the alloy is not uniform in the matrix, and the reliability of the process performance and mechanical properties of the composite solder alloy is average.

Method used

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  • Endogenetic Cu6Sn5 granule reinforced leadless compound solder alloy and manufacture method thereof
  • Endogenetic Cu6Sn5 granule reinforced leadless compound solder alloy and manufacture method thereof
  • Endogenetic Cu6Sn5 granule reinforced leadless compound solder alloy and manufacture method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] 1) Mix 26 grams of potassium oxide and 20 grams of lithium oxide salt, melt it at 450°C, and pour it on 40 grams of Sn-3.5Ag eutectic alloy;

[0028] 2) Continue heating at 450°C, and after the Sn-Ag alloy melts, add 4.399 grams of Cu and 6.848 grams of Sn;

[0029] 3) Continue to heat at 450°C, and keep stirring until the Cu and Sn particles are completely melted, then keep it warm for 1 hour. During the heat preservation period, start stirring the alloy melt every 10 minutes from the 30th minute. / sec cooling rate to cool to room temperature, remove surface mixed salts, and obtain endogenous Cu 6 sn 5 Particle-reinforced tin-silver based lead-free composite solder alloy.

Embodiment 2

[0031] 1) with embodiment 1 step 1);

[0032] 2) with embodiment 1 step 2);

[0033] 3) Continue to heat at 450°C and keep stirring until the Cu and Sn particles are completely melted, then keep it warm for 1 hour. During the heat preservation period, start stirring the alloy melt every 10 minutes from the 30th minute. Stir three times in total. / sec cooling rate to cool to room temperature, remove surface mixed salts, and obtain endogenous Cu 6 sn 5 Particle-reinforced tin-silver based lead-free composite solder alloy.

Embodiment 3

[0035] 1) with embodiment 1 step 1);

[0036] 2) with embodiment 1 step 2);

[0037] 3) Continue to heat at 450°C, and keep stirring until the Cu and Sn particles are completely melted, then keep it warm for 1 hour. During the heat preservation period, start stirring the alloy melt every 10 minutes from the 30th minute. / sec cooling rate to cool to room temperature, remove surface mixed salts, and obtain endogenous Cu 6 sn 5 Particle-reinforced tin-silver based lead-free composite solder alloy.

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Abstract

The invention relates to an endogenous Cu6Sn5 particulate reinforced tin and silver based lead-free composite solder alloy and the preparation method, belonging to the technical field of manufacturing lead-free solder for electronic assembly in the microelectronic industry. The composite solder prepared by a traditional endogenous method has uneven distribution of the endogenous particles, and the technology and mechanical property of solder are influenced. The composite solder of the invention is composed of Cu6Sn5 reinforced particles and the eutectic alloy of Sn-3.5Ag; the volume percentages of the two components are respectively 20 percent and 80 percent. The invention is characterized in that potassium chloride and lithium chloride are mixed and melted according to the weight percentage of 1.3:1, and then poured on the eutectic alloy of Sn-3.5Ag; when the eutectic alloy of Sn-3.5Ag is melted, Cu and Sn particles are added; the mixture is preserved at the temperature of 450 DEG C, stirred and staying silently; then the mixture is rapidly cooled to room temperature at a rate of 20, 2, 0.6 or 0.1 DEG C / sec; the complex solder of the invention is obtained by removing mixed salt. The complex solder of the invention has the advantages of low cost, convenient smelting, and good mechanical property and creep resistance.

Description

technical field [0001] The invention belongs to the technical field of manufacturing lead-free solder for electronic assembly in the microelectronics industry, and in particular relates to endogenous Cu 6 sn 5 Particle-reinforced tin-silver-based lead-free composite solder alloy and a preparation method thereof. Background technique [0002] The traditional Sn-Pb solder has been widely used as a brazing material in electronic packaging and installation technology due to its simple composition, mature process, and good brazing process performance and mechanical properties. [0003] However, lead is a toxic element, which is very harmful to the environment and human health. The European Union has banned the use of lead-containing solder in 2006, and the United States and Japan have also actively adopted legislation to reduce and prohibit the use of harmful elements such as lead. Therefore, the research and development of green and environment-friendly lead-free solders to r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/24C22C1/02
Inventor 郭福邰枫韩孟婷夏志东雷永平史耀武
Owner BEIJING UNIV OF TECH
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