Method for printing transfer printing film and forming pattern on printing stock
A technology for transfer film and substrate, which is applied in the process of producing decorative surface effects, decorative arts and other directions, which can solve the technical requirements of transfer film, high equipment requirements, inability to realize personalized production, and difficult control of workers' operation. and other problems to achieve the effect of enhancing elasticity and adhesion fastness, satisfying individualization and industrialization, and simplifying the production process
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0010] according to figure 2 As shown, the transfer film in the prior art is composed of a transfer carrier film 1, a release layer 2, a color layer 3, a background layer 4, and a hot melt adhesive layer 5. The release layer 2 can be partially coated on the transfer carrier film 1 or coated on the transfer carrier film 1 as a whole. The color layer 3, the background layer 4 and the hot-melt adhesive layer 5 are only printed on the parts with pictures and texts. Color layer 3 should be printed by screen printing, gravure printing, or offset printing. No matter which printing method is adopted for graphic color layer 3, a negative film must be produced and then plated.
[0011] according to figure 1 As shown, the printing transfer film of the present invention includes a transfer carrier film 1, a release layer 2, a hot melt adhesive layer 5 and a printable layer 6. The transfer carrier film 1 is entirely covered with a release layer 2, and The molding layer 2 is entirely covered w...
PUM
Property | Measurement | Unit |
---|---|---|
Softening temperature | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com