Probe measuring clip having ZIF connector, assembly method, wafer test system and test method thereof

Abstract

The invention discloses a needle testing card with a ZIF connector, mainly comprising a needle testing substrate, a plurality of ZIF connectors and a plurality of locking components which can be adjusted in a dismountable way. The needle testing substrate is in disc shape and provided with a first surface, a second surface, a plurality of sunk parts which are arranged on the second surface and a plurality of groups of first through holes which vertically pass through the first surface and the second surface of the substrate; a plurality of groups of through holes face the center of the needle testing substrate and are arranged in ring-shape; the two sides of a plurality of groups of first through holes of the first surface are provided with first electric joints which are arranged in pairs. A plurality of needle testing terminals are convex out of the second surface of the needle testing substrate and used for being contacted with wafers and measuring electric signals.

Description

technical field [0001] The invention relates to a probing card and testing equipment for wafer testing, and in particular to a structure of the probing card with a ZIF connector on it and an assembly method of the probing card. Background technique [0002] In the semiconductor wafer manufacturing process, in order to test the good and bad of the die on the wafer before the wafer is cut, it is necessary to use a high-performance probe card (probe card) to perform wafer testing, such as U.S. Patent No. 6,292,005 and Disclosed in Taiwan patent TW460703. The needle test card has a precise contact mechanism, which is used to make contact with the wafer to be tested, conduct the circuit, and perform electrical tests. [0003] Please refer to Figure 1A , is a schematic diagram of the wafer testing system. The control system 10 sends a test signal, which is transmitted to a test head (generally referred to as a tester in the art) 12, which has a motherboard (motherboard) 15 and ...

AI Technical Summary

Problems solved by technology

In the step of replacing the ZIF connector 18, the rivet head must be removed with a sharp knife to remove the rivet. However, if the force is applied inadvertently, the ZIF connector 18 will be damaged at the slightest, and the probe card 19 will be damaged at the worst.

The probe card 19 has a rather complex structure, generally composed of multi-layer boards (multi-layer), usually up to more than twelve layers, and the pads on it are very small in distance, and must be processed by semiconductor-level manufacturing processes. done, very expensive

However, it is often necessary to scrap the entire set in order to adjust, disassemble or adjust a ZIF connector 18 to cause damage, and the cost is extremely high. Therefore, how to connect, replace and adjust the ZIF connector and the probe card conveniently and effectively is an urgent problem for the industry to solve. question

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