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Monocomponent UV-curing rapid-repairing adhesive

An ultraviolet light, one-component technology, applied in the field of adhesive repairing agent, can solve the problems of incomplete curing, incomplete curing and adhesion, inconvenient use, etc., to achieve the effect of convenient construction, overcoming large curing shrinkage, and good comprehensive performance.

Inactive Publication Date: 2008-12-31
JIANGSU UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional adhesives are difficult to cure and bond within 10 seconds. Although ultraviolet curing adhesives can be cured quickly, they cannot be fully cured for places with a certain thickness or where ultraviolet rays cannot be irradiated.
Although the recently developed light-dark curing technology can solve the problem that ultraviolet rays cannot be cured, it is composed of two components, which brings great inconvenience to use.

Method used

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  • Monocomponent UV-curing rapid-repairing adhesive
  • Monocomponent UV-curing rapid-repairing adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Reactive oligomers 40%

[0018] Butyl methacrylate 20%

[0019] Tripropylene glycol diacrylate (TPGDA) 15%

[0020] 2-Hydroxy-2-methyl-1-phenylacetone 5%

[0021] SiO 2 20%

[0022] The method for preparing and using the fast repairing adhesive is as follows: mixing the above-mentioned proportioning components, stirring, grinding with a sand mill, filtering, and packing; and curing with a portable light curing machine during use.

Embodiment 2

[0024] Reactive oligomers 35%

[0025] Butyl methacrylate 35%

[0026] Tripropylene glycol diacrylate (TPGDA) 12%

[0027] 2-Hydroxy-2-methyl-1-phenylacetone 1%

[0028] SiO 2 17%

[0029] Preparation and use quick repair adhesive method is the same as embodiment 1.

Embodiment 3

[0031] Reactive oligomers 35%

[0032] Butyl methacrylate 35%

[0033] Tripropylene glycol diacrylate (TPGDA) 5%

[0034] 2-Hydroxy-2-methyl-1-phenylacetone 5%

[0035] SiO 2 20%

[0036] Preparation and use quick repair adhesive method is the same as embodiment 1.

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Abstract

The invention discloses a single component ultraviolet dark curing quick mending adhesive which contains (based on weight percentage) 25-40%of active oligomer, 20-35%of butyl methacrylate, 5-15%of tripropylene glycol diacrylate (TPGDA), 1-5%of 2-Hydroxy-2-methylpropiophenone and 5-20%of SiO2. The components are mixed and blended, then ground through a sand mill and at last filtered and caned. When in use, a portable light curing unit is applied for curing. With single component, the quick mending adhesive is convenient to process and the curing system is applicable to the places that ultraviolet radiation fails to reach and the occasions that the adhesive is thick or that the ultraviolet can not penetrate. The invention makes best use of the speediness of ultraviolet curing and the completeness of dark curing, thereby making the whole system reaching the best comprehensive performance.

Description

technical field [0001] The invention belongs to the field of adhesive repairing agents, and in particular relates to a one-component ultraviolet light dark-curing fast repairing adhesive. The fast repair adhesive is used for fast bonding repair of materials at normal temperature. Background technique [0002] In recent years, due to the rapid development of rapid repair and emergency repair of airstrips, highways, bridges, fuel tanks, etc., new requirements have been put forward for the rapid repair of adhesives. Traditional adhesives are difficult to cure and bond within 10 seconds. Although ultraviolet curing adhesives can be cured quickly, they cannot be fully cured for places with a certain thickness or where ultraviolet rays cannot be irradiated. Although the recently developed light-dark curing technology can solve the problem that ultraviolet rays cannot be cured, it is composed of two components, which brings great inconvenience to use. Contents of the invention ...

Claims

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Application Information

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IPC IPC(8): C09J4/02
Inventor 高延敏韩广帅王晓艳张海凤
Owner JIANGSU UNIV OF SCI & TECH