Laser irradiation apparatus and laser processing system using the same
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- OLYMPUS CORP
- Publication Date
- 2009-01-28
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The present invention relates to a laser irradiation device and a laser processing system using the laser irradiation device. Background technique
[0002] Conventionally, a laser processing device (laser irradiation device) is known that performs processing by irradiating a laser beam to a desired region of a workpiece. For example, in the manufacture of liquid crystal displays and the like, laser trimming devices are known as devices for trimming defective parts such as wiring patterns on glass substrates and unnecessary residues present on photomasks used for exposure.
[0003] For example, the laser processing device described in Patent Document 1 (Japanese Unexamined Patent Publication No. 8-174242) has: a laser source; a processing table on which a workpiece is placed; ), by turning ON / OFF (ON / OFF) control to switch the angles of a plurality of reflective mirrors of the micro-mirror array to form arbitrary pattern shapes on the workpiece. [00...