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Manufacturing method of hollowed-out PCB

一种制作方法、电路板的技术，应用在印刷电路制造、印刷电路、印刷电路等方向，能够解决线路侧蚀、高度差、过蚀等问题

Inactive Publication Date: 2009-02-04
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The protective film is usually a dry film, but there is a height difference between the insulating substrate and the copper foil at the first opening, the protective film cannot be fully attached to the first surface of the copper foil, and a gap will be generated at the boundary of the first opening , during the production of the circuit, the etching solution will enter this gap, resulting in side etching and over-etching of the circuit on the back of the copper foil

Method used

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  • Manufacturing method of hollowed-out PCB
  • Manufacturing method of hollowed-out PCB
  • Manufacturing method of hollowed-out PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] refer to figure 1 , the hollow circuit board manufacturing method provided by the technical solution includes the following steps:

[0018] Step 1, see figure 2 , providing a copper foil 10 . Copper foil 10 may be electrolytic copper foil or rolled copper foil. The copper foil 10 includes a first surface 102 and a second surface 104 opposite to each other. Preferably, the copper foil 10 may be treated with an acid cleaning solution to remove dirt on the first surface 102 and the second surface 104 of the copper foil and increase the roughness of the first surface 102 and the second surface 104 of the copper foil.

[0019] Step 2, pressing the first insulating substrate 12 preformed with the first opening 122 on the first surface 102 of the copper foil 10 .

[0020] refer to image 3 , there are two first openings 122 on the first insulating substrate 12 . Of course, one or more first openings can also be provided on the first insulating substrate 12 according to ...

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Abstract

The invention relates to a preparing method of a skeleton circuit board, which includes steps as following: a copper foil is provided, and the copper foil includes a first surface and a second surface which are opposite; a layer of first insulating substrate with pre-shaped first opening is pressed on the first surface of the copper foil; a protection layer is formed at the opening of the first insulating substrate so as to fully cover the copper foil exposed from the first opening; a circuitry can be made in the copper foil; the protection layer at the first opening is removed; a layer of the second insulating substrate with pre-shaped second opening is pressed on the second surface of the copper foil, and the first opening is corresponding to the second opening. The preparing method of the skeleton circuit board can prevent the etching liquor from entering into the copper foil to near a side surface of the insulating substrate so as to cause the circuitry lateral erosion or over erosion.

Description

technical field [0001] The invention relates to a method for manufacturing a printed circuit board, in particular to a method for manufacturing a hollow circuit board. Background technique [0002] Flexible Printed Circuit Board (FPCB) is widely used in various electronic products with relative movement between parts during operation, such as displays, folding mobile phones, printing heads, hard disk reading heads, etc., due to its excellent flexural resistance. Provides power / signal transmission. [0003] A circuit board generally includes an insulating substrate and conductive traces formed on the insulating substrate. Conductive traces are usually made of copper. The most commonly used material for insulating substrates is polyimide, but composite materials have recently begun to be used as insulating substrates to improve the performance of circuit boards, see Bong Sup Kim et al., Polyimide / Carbon Nanotubes Composite Films: A Potential for FPCB, 2006. ICONN'06. Intern...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/02H05K3/28
CPCY10T29/49156H05K3/061H05K2201/09063H05K2203/063Y10T29/49117Y10T29/49128H05K3/281Y10T29/49165Y10T29/49155H05K2203/308Y10T29/49126H05K3/4092H05K2201/0397
Inventor 黄晓君吴孟鸿林承贤
Owner AVARY HLDG (SHENZHEN) CO LTD
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