Manufacturing method of hollowed-out PCB

一种制作方法、电路板的技术，应用在印刷电路制造、印刷电路、印刷电路等方向，能够解决线路侧蚀、高度差、过蚀等问题
CN101360397AInactive Publication Date: 2009-02-04AVARY HLDG (SHENZHEN) CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
AVARY HLDG (SHENZHEN) CO LTD
Publication Date
2009-02-04
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a preparing method of a skeleton circuit board, which includes steps as following: a copper foil is provided, and the copper foil includes a first surface and a second surface which are opposite; a layer of first insulating substrate with pre-shaped first opening is pressed on the first surface of the copper foil; a protection layer is formed at the opening of the first insulating substrate so as to fully cover the copper foil exposed from the first opening; a circuitry can be made in the copper foil; the protection layer at the first opening is removed; a layer of the second insulating substrate with pre-shaped second opening is pressed on the second surface of the copper foil, and the first opening is corresponding to the second opening. The preparing method of the skeleton circuit board can prevent the etching liquor from entering into the copper foil to near a side surface of the insulating substrate so as to cause the circuitry lateral erosion or over erosion.
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Description

technical field

[0001] The invention relates to a method for manufacturing a printed circuit board, in particular to a method for manufacturing a hollow circuit board. Background technique

[0002] Flexible Printed Circuit Board (FPCB) is widely used in various electronic products with relative movement between parts during operation, such as displays, folding mobile phones, printing heads, hard disk reading heads, etc., due to its excellent flexural resistance. Provides power / signal transmission.

[0003] A circuit board generally includes an insulating substrate and conductive traces formed on the insulating substrate. Conductive traces are usually made of copper. The most commonly used material for insulating substrates is polyimide, but composite materials have recently begun to be used as insulating substrates to improve the performance of circuit boards, see Bong Sup Kim et al., Polyimide / Carbon Nanotubes Composite Films: A Potential for FPCB, 2006. ICONN'06. Intern...

Claims

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