Thick copper circuit board and manufacturing method thereof

A manufacturing method and circuit board technology, applied in chemical/electrolytic methods to remove conductive materials, printed circuit components, printed circuit secondary treatment, etc., can solve problems such as line side erosion and pool effect

Active Publication Date: 2021-11-09
AVARY HLDG (SHENZHEN) CO LTD +1
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing thick copper circuit board is prone to pool effect during

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thick copper circuit board and manufacturing method thereof
  • Thick copper circuit board and manufacturing method thereof
  • Thick copper circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0047] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the ot...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to view more

Abstract

The invention provides a manufacturing method of a thick copper circuit board, which comprises the steps of providing a copper-plated substrate which comprises a base material layer and a first copper layer, and etching the first copper layer to form a first circuit layer; covering the first circuit layer with a filler layer; performing laser ablation on the top layer of the filler layer to expose the first circuit layer; forming a metallized film on the upper surface of the filler layer; forming a second copper layer to the surfaces of the metalized film and the first circuit layer; and etching the second copper layer to form a second circuit layer. According to the manufacturing method of the thick copper circuit board, the filler layer and the metallized film are arranged on the first circuit layer, and the second circuit layer is formed by taking the first circuit layer and the filler layer as references, so that the purpose of thickening the copper layer is achieved, the pool effect can be inhibited, and lateral erosion is avoided. The invention further provides a thick copper circuit board.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a thick copper circuit board and a manufacturing method thereof. Background technique [0002] As the application range of printed circuit boards becomes wider and wider, automotive electronics is largely different from consumer electronics, especially in terms of withstand voltage and high current, which have higher requirements for PCBs. According to the principle of PCB current carrying, we know that the larger the cross-sectional area of ​​the line, the stronger the current carrying capacity; but under the trend of requiring the PCB to be "small", we can only sacrifice the trend of thinness to meet its current carrying capacity, so it is Thick copper must be used to meet the current carrying capacity. However, the existing thick copper circuit board is prone to pool effect during the manufacturing process, resulting in the problem of side erosion of the circuit. Conte...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/24H05K3/06H05K1/11
CPCH05K3/24H05K3/06H05K1/11
Inventor 何四红
Owner AVARY HLDG (SHENZHEN) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap