Process for manufacturing graph in circuit burying mode

Abstract

The invention discloses a process for manufacturing a graph in a circuit burying mode. The process comprises the following steps: pasting copper foils to the two sides of a carrier plate through an adhesive; attaching a dry film to the carrier copper foil, and manufacturing a to-be-plated pattern on the dry film; electroplating the carrier core plate to which the dry film is attached; taking downthe dry film on the carrier core plate plated with the copper layer; laminating the plurality of carrier core plates plated with the copper layers; separating the copper layer on the carrier core plate from the carrier plate; pressing the core plate after the carrier plate is taken out again; drilling a hole in the laminated core plate; cleaning and wetting the drilled hole; attaching dry films tothe surfaces of the two sides of the laminated core plate, and forming holes in the drilled positions of the core plate; carrying out metallization treatment on the holes in the dry film openings inthe core plate; and taking down the dry films on the surfaces of the two sides of the core plate. The method has the advantages that the etching side etching problem is avoided, the manufactured circuit better meets the design requirement, and the capacity of a factory for manufacturing a board with a finer circuit is improved under the condition that traditional PCB equipment conditions are not changed.

Description

technical field [0001] The invention relates to the technical field of PCB technology, in particular to a technology for making graphics by embedding lines. Background technique [0002] With the development of electronic technology, customers' requirements for PCB are becoming more and more stringent. Many new electronic products require PCB to be more precise and stable. However, traditional PCB graphics technology and manufacturing equipment have been difficult to meet new customer needs. The purpose of this new process is to produce more precise and stable circuit patterns without making major changes to the traditional PCB process and manufacturing equipment. [0003] The traditional PCB graphics manufacturing process adopts the process of "making graphic protection layer-etching-removing the protective layer" to make lines. During the etching process, the etching solution will attack the area to be etched and the side wall of the protected graphics at the same time, re...

AI Technical Summary

Problems solved by technology

It solves the problem that the traditional PCB graphic manufacturing process adopts the process of "making graphic protective layer-etching-removing protective layer" to make lines. During the etching process, the etching potion will attack the area to be etched and the side wall of the protected graphic at the same time, resulting in "side erosion" of the line. "phenomenon, the circuit completed in this way is not a "rectangular" shape but a "trapezoidal" shape, and the completed circuit often has the problem that the bottom edge of the circuit is uneven

This has a great adverse effect on the integrity of electrical signal transmission and the need to make more sophisticated circuits

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