Unlock instant, AI-driven research and patent intelligence for your innovation.

Load moving container and bearing structure applicable to the same

A container and transfer technology, which is applied to photomechanical processing of originals, instruments, and patterned surfaces for photomechanical processing, etc. Or offset and other problems to achieve the effect of improving competitiveness and economic benefits, reducing generation and scratching, and avoiding direct sliding and impact.

Inactive Publication Date: 2009-02-11
E SUN PRECISION IND
View PDF3 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For this reason, once had the industry to develop a kind of as China Taiwan Patent Publication No. TWI224719 " the device of photomask holder ", its main technology is to design a convex that utilizes polyetheretherketone (PEEK) to make in the photomask box The top block is used to support the photomask, and the top edge of the convex top block is formed with a support portion inclined toward the center and showing a slight arc. Although the design of the previous patent can overcome the problem of the traditional ones that are prone to generating particles, its The contact area is still too large, and the combination with the base is not good. In the environment of cold and heat exchange, it is easy to loosen due to changes in thermal expansion and contraction, causing inconvenience and troubles in use.
[0006] Moreover, no matter it is the photomask box of the existing or the aforementioned patents during use, if the photomask 20 is placed on the supporting block 16 or the convex top block of the base 12 by artificial placement, It is easy to be affected by the obstruction or deviation of the line of sight during placement, resulting in a great error in the position of the photomask 16 after placement, causing one side of the photomask 16 to be separated from one of the supporting blocks 16 or the convex top block. drop from above, so that the bottom surface of the photomask 20 is easy to directly collide with the upper surface of the base 12, and then cause the bottom surface of the photomask 20 to be damaged due to collision

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Load moving container and bearing structure applicable to the same
  • Load moving container and bearing structure applicable to the same
  • Load moving container and bearing structure applicable to the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0050] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the transfer container proposed according to the present invention and the supporting structure applied to the transfer container will be described below in conjunction with the accompanying drawings and preferred embodiments. Embodiments, structures, features and effects thereof are described in detail below.

[0051] The present invention is a transfer container supporting structure for objects such as photomasks or wafers in the semiconductor manufacturing process, please refer to figure 2 As disclosed, the preferred embodiment of the present invention takes the transfer container 5 for accommodating the photomask 70 as the main embodiment, and the transfer container 5 includes a base 50 and a cover 60 . The photomask 70 is supported and placed on the base 50 , and the cover 60 is used to cover and combine with the base 50 to form a ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a shifting container and a support structure for supporting articles inside the shifting container during the manufacturing process of a semiconductor. The shifting container comprises a base and a casing cover; wherein an inverted U-shaped support body composed of two support bases and abutting elements is arranged on the base, a support element made from a wear resistant material with high hardness is arranged on each end of the opposite inner edges of two support bases on the two sides, each support element has a higher first lug and a lower second lug, arc-shaped edges are formed at the top ends of the first lug and the second lug to reduce the contact area of the article to be supported, and the two support elements of the same support base allow the lower second lug to be positioned on the opposite inner side, so that the article which deviates and slides away from the higher first lug can stilled be supported by the lower second lug, the frictional area between the object and the support elements can be reduced for avoiding the generation of particulates and preventing damage of the object due to instantaneous sliding off and impact, and the manufacturing yield of the semiconductor is improved.

Description

technical field [0001] The invention belongs to the technical field of supporting objects inside a transfer container in a semiconductor manufacturing process, and specifically relates to a transfer container support structure that can reduce the contact area of ​​the support and provide secondary support, so as to reduce Particles are generated due to friction between the object and the supporting structure, and it can further prevent the object from being broken due to slippage and impact. Background technique [0002] In recent years, affected by the continuous development of electronic products towards light, thin, high-frequency, high-performance and other characteristics, the core chips used in electronic products must be further miniaturized and high-performance. High performance requires miniaturization of the wire diameter of the integrated circuit on the chip to accommodate more integrated circuits and components. Therefore, the wire diameter of the existing integr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/673H01L21/677G03F1/00G03F7/20G03F1/66
Inventor 廖莉雯陈俐慇
Owner E SUN PRECISION IND