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Curable resin composition, surface protection method, temporary fixation method, and separation method

A technology of curable resin and composition, applied in the direction of bonding method, non-polymer organic compound adhesive, special surface, etc., can solve the problems of working environment, complicated cleaning process, inability to remove protective film, etc. To achieve the effect of shortened work, excellent workability, and easy recycling

Active Publication Date: 2009-02-18
DENKA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since organic solvents are used, the cleaning process is complicated and there are problems in the working environment
In addition, in the case of fine unevenness, since the organic solvent cannot penetrate sufficiently, and the protective film cannot be completely removed, there will be a problem in the appearance of the workpiece.

Method used

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  • Curable resin composition, surface protection method, temporary fixation method, and separation method
  • Curable resin composition, surface protection method, temporary fixation method, and separation method
  • Curable resin composition, surface protection method, temporary fixation method, and separation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-1

[0174] As (A) multifunctional (meth)acrylate, mix 20 parts by mass of TE-2000, 15 parts by mass of R-684, as (B) monofunctional (meth)acrylate, mix 40 parts by mass of M- 140, 25 parts by mass of M-101A, a total of 100 parts by mass of (A) and (B) and 1 part by mass of Quintone 1700 as (C) a resin having a cyclopentadiene skeleton, 10 parts by mass as (D) BDK as a photopolymerization initiator, 2 parts by mass of IPA as a (E) polar organic solvent, and 0.1 part by mass of MDP as a polymerization inhibitor were blended to prepare a curable resin composition. Using the obtained curable resin composition, the measurement of the tensile shear adhesive strength of the hardened|cured body, and a peeling test were performed by the evaluation method shown above. These results are shown in Table 1-1.

Embodiment 1-2～1-21

[0176] Except having used the raw material of the kind shown in Table 1-1 and Table 1-2 in the composition shown in Table 1-1 and Table 1-2, it prepared similarly to Example 1-1 and curable resin composition. About the obtained curable resin composition, the measurement of the tensile shear adhesive strength and the peeling test were performed similarly to Example 1-1. These results are shown in Table 1-1 and Table 1-2.

[0177] [Table 1-1]

[0178] Example No. 1-1 1-2 1-3 1-4 1-5 1-6 1-7 1-8 1-9 1-10 1-11 (A) Component (parts by mass) TE-2000 20 20 20 20 20 20 20 20 20 20 20 R-684 15 15 15 15 15 15 15 15 15 15 15 (B) Component (parts by mass) M-140

M-101A 40

25 40

25 40

25 40

25 40

25 40

25 40

25 40

25 40

25 40

25 40

25 (E) Ingredients 1PA (boiling point 82°C) 2 2 2 2 2 2 2 2 2 2 ...

Embodiment 1-22

[0191] Using the curable resin composition of Example 1-1, using a curing device made by Fusion Co., Ltd. using an electrodeless discharge lamp, the integrated light intensity at a wavelength of 365 nm was changed to 500, 1000, 2000, and 4000 mJ / cm 2 And the curable resin composition was hardened, and the measurement of the tensile shear adhesive strength and the peeling test were performed similarly to Example 1-1 except having produced the peeling test body and the tensile shear adhesive strength test piece. These results are shown in Tables 1-4.

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Abstract

Disclosed is a curable resin composition for surface protection capable of forming a protection film, which is environmental friendly while having good adhesion strength and can be easily removed in a film form in water without leaving any adhesive residue, on a member to be processed. Also disclosed are a photocurable adhesive using such a curable resin composition, a method for temporarily fixing a member, and a method for separating a protection film. Specifically disclosed is a curable resin composition for surface protection, which is characterized by containing a polyfunctional (meth)acrylate (A), a monofunctional (meth)acrylate (B), and a resin (C) having a cyclopentadiene skeleton. Also specifically disclosed is a curable resin composition for surface protection, which is characterized by containing a polyfunctional (meth)acrylate (A), a monofunctional (meth)acrylate (B), a resin (C) having a cyclopentadiene skeleton, and a photopolymerization initiator (D). Further specifically disclosed is a curable resin composition for surface protection, which is characterized by containing a polyfunctional (meth)acrylate (A), a monofunctional (meth)acrylate (B), a resin (C) having a cyclopentadiene skeleton, a photopolymerization initiator (D), and a polar organic solvent (E).

Description

technical field [0001] The present invention relates to a surface protective film for protecting the processed member from cutting chips and the like when processing various members, and for protecting the undesired coating when the processed member is painted or printed with ink or the like. Or a surface protective film (hereinafter also referred to as "protective film") for temporary fixing of printed parts. It also relates to a curable resin composition suitable for the surface protection film, and a surface protection method for protecting the surface of a member to be processed using an adhesive composed of the curable resin composition. [0002] More specifically, the present invention relates to a method for peeling a protective film covering a processed member when peeling the member, and a photocurable adhesive suitable for the use. It also relates to a temporary fixing method of a processed member, that is, bonding the processed member to a base material, after proc...

Claims

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Application Information

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IPC IPC(8): C09D4/02B05D5/00C08F2/44C08F220/10C08F290/04C09D5/20C09J4/02C09J5/00
Inventor 金井朋之大岛和宏
Owner DENKA CO LTD
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