Curable resin composition, surface protection method, temporary fixation method, and separation method
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- DENKA CO LTD
- Publication Date
- 2009-02-18
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Abstract
Description
technical field
[0001] The present invention relates to a surface protective film for protecting the processed member from cutting chips and the like when processing various members, and for protecting the undesired coating when the processed member is painted or printed with ink or the like. Or a surface protective film (hereinafter also referred to as "protective film") for temporary fixing of printed parts. It also relates to a curable resin composition suitable for the surface protection film, and a surface protection method for protecting the surface of a member to be processed using an adhesive composed of the curable resin composition.
[0002] More specifically, the present invention relates to a method for peeling a protective film covering a processed member when peeling the member, and a photocurable adhesive suitable for the use. It also relates to a temporary fixing method of a processed member, that is, bonding the processed member to a base material, after proc...