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However, the disadvantage of these resins is the high production cost
Method used
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Examples
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Embodiment 1
Epoxy resin 1: 9.05 parts by weight (shown in formula (17), the phenolic resin prepared by the co-condensation reaction of phenol, formaldehyde and 2-methoxynaphthalene and the glycidyl etherification of epichlorohydrin are prepared. In Epoxy equivalent in formula (17): 251, softening point: 58°C, and m / n=1 / 4)
[0077]
Phenolic resin 1: 3.75 parts by weight (represented by formula (5) (manufactured by Sumitomo Durez, PR-HF-3, d=0 and k=3.0 in formula (5), softening point: 80°C, hydroxyl equivalent: 104) .
These compounds were mixed in a mixer at normal temperature, and kneaded at 80 to 100° C. using hot rollers. After cooling, ...
Embodiment 2 to 18 and comparative Embodiment 1 to 5
Epoxy resin compositions were produced as in Example 1 according to the compositions shown in Tables 1, 2 and 3, and evaluated as in Example 1. The results are shown in Tables 1, 2 and 3.
The novel components used in these examples are as follows:
Epoxy resin 2: represented by formula (17), prepared by glycidyl etherification of phenolic resin prepared by the co-condensation reaction of phenol, formaldehyde and 2-methoxynaphthalene and epichlorohydrin. In formula (17), epoxy equivalent: 220, softening point: 52°C, and m / n=1 / 9.
Epoxy resin 3: represented by formula (17), prepared by glycidyl etherification of phenolic resin prepared by the co-condensation reaction of phenol, formaldehyde and 2-methoxynaphthalene and epichlorohydrin. In formula (17), epoxy equivalent: 270, softening point: 63°C, and m / n=3 / 7.
[0083]
Epoxy resin 4: represented by formula (18), prepared by glycidyl etherification of phenolic resin prepared by the co-condensation reaction of phenol, form...
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Abstract
The present invention provides an epoxy resin composition for semiconductor encapsulation which contains an epoxy resin (A); a phenolic compound (B) containing two or more phenolic hydroxyl groups; an inorganic filler (C); and a curing accelerator (D). The epoxy resin (A) contains an epoxy resin (a1) represented by the formula (1), and the resin composition has a moistureabsorption rate of 0.22 weight % or less when the composition is humidified at 85 DEG C. and 85% R.H. for 168 hours.
Description
technical field [0001] The present invention relates to a resin composition for semiconductor sealing and a semiconductor device. Background technique [0002] In electronic devices and semiconductor devices, the recent trend is toward higher density and higher integration, such as integrated circuits (ICs), large-scale integrated circuits (LSIs) and very large-scale integrated circuits (VLSIs). Installation to surface mount conversion. Such trends require lead frames with increased numbers of pins and reduced spacing of the leads. Surface mount quad flat packs (QFPs), which are compact and lightweight, are used in a variety of semiconductor devices. These semiconductor devices are usually sealed with epoxy resin compositions, which simultaneously have high productivity, low material cost, and high reliability. [0003] Since these epoxy resin compositions used for semiconductor sealing must be nonflammable, brominated epoxy resins (such as tetrabromobisphenol A epo...
Claims
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