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Image sensor having large micro-lenses at the peripheral regions

An image sensor and microlens technology, applied in the field of image sensors, can solve problems such as non-perpendicularity

Inactive Publication Date: 2011-02-23
HUA WEI SEMICONDUCTOR (SHANGAHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for pixels in the outer region of the image sensor 101, the incident light from the imaging lens 204 is not perpendicular to the microlens, resulting in the focused incident light not being aligned with the photodetection unit

Method used

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  • Image sensor having large micro-lenses at the peripheral regions
  • Image sensor having large micro-lenses at the peripheral regions
  • Image sensor having large micro-lenses at the peripheral regions

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Embodiment Construction

[0014] The invention relates to a microlens structure for an image sensor of the CMOS or CCD type. Specifically, the microlenses covering pixels in the outer (peripheral) regions of the image sensor array have a different shape (eg taller) than the microlenses in the central region of the image sensor. In the following description, various specific details are provided in order to provide a more thorough understanding of embodiments of the invention. However, one of ordinary skill in the art will recognize that the present invention may be practiced without one or more of the specific details, or with other methods, components, and the like. In other instances, well-known structures or operations are not shown or described in detail to avoid obscuring the various embodiments of the invention.

[0015] Reference throughout this specification to "an embodiment" or "an embodiment" means that a feature, structure, or characteristic described in connection with the embodiment is i...

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Abstract

An image sensor includes an array of pixels formed in a semiconductor substrate. The pixels are grouped as a center portion of pixels and an outer portion of pixels. A first set of micro-lenses is formed over each of the pixels in the center portion of pixels. A second set of micro-lenses is formed over each of the pixels in the outer portion of pixels. The second set of micro-lenses differ from said first set of micro-lenses. In one embodiment, the second set of micro-lenses are taller than the first set of micro-lenses.

Description

[0001] This application is a divisional application of the invention patent application with the filing date of October 23, 2003, the application number of 200310102569.0, and the invention title of "image sensor with a large microlens in the peripheral area". technical field [0002] The present invention relates to image sensors, and more particularly to image sensors having taller microlenses in the outer regions of the pixel array. Background technique [0003] Image sensors are electronic integrated circuits that can be used to produce still and video images. The solid state image sensor may be one of a Charge Coupled Device (CCD) type or a Complementary Metal Oxide Semiconductor (CMOS) type. In any image sensor, a light-collecting pixel is formed on a substrate and arranged in a two-dimensional array. Modern image sensors typically include millions of pixels to provide a high-resolution image. An important part of the image sensor is the structure of the color filter...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B3/00G03C5/00H01L21/00G02B5/20H01L31/0216H01L27/146G02B1/04H01L29/04H04N5/369
CPCH01L27/14627H01L27/14685
Inventor 山本克己
Owner HUA WEI SEMICONDUCTOR (SHANGAHAI) CO LTD