Double-interface smart card module and loading belt

A dual-interface smart card and smart card technology, which is applied to record carriers, instruments, and electrical components used by machines, can solve problems such as application restrictions and shortened card reading distances

Inactive Publication Date: 2009-04-15
SHANGHAI CHANGFENG SMART CARD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the effect of the current products in the application of contactless cards is not ideal. The reason is that the process of the carrier tape determines that there is a large equivalent input capacitance in the non-contact carrier tape itself, so that the contact

Method used

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  • Double-interface smart card module and loading belt
  • Double-interface smart card module and loading belt
  • Double-interface smart card module and loading belt

Examples

Experimental program
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Effect test

Embodiment Construction

[0017] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further elaborated below in conjunction with specific examples.

[0018] see figure 1 , figure 2 with image 3 , a dual-interface smart card module, including a carrier tape 1 and a chip 2, a standard smart card contact point 3 is provided on the contact surface of the carrier tape 1, and a non-contact lead pad is provided on the lead welding surface 4 of the carrier tape 1 5. The line 6 and the pad 7 of the external antenna. The smart card contact point 5, non-contact lead pad 5, line 6 and pad 7 of the external antenna are made of the required graphics through the copper-clad etching process, and then finished with nickel plating and gold plating once, with good contact properties and antioxidant properties.

[0019] see Figure 4 , the base material of the carrier tape 1 adopts epoxy resin base material w...

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PUM

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Abstract

The invention relates to a double-interface intelligent card module and a carrier tape. The double-interface intelligent card module comprises the carrier tape and a chip and is characterized in that a standard intelligent card contact point is arranged at a contact surface of the carrier tape; a lead wire welding surface of the carrier tape is provided with a non-contact lead wire bonding pad and a circuit and external antenna bonding pad. The intelligent card contact point, the non-contact lead wire bonding pad and the circuit and external antenna bonding pad are processed by a copper-bonded etching technology to prepare required designs and then the designs are processed by one time of nickel electroplating and one time of gold electroplating. The invention sends a module semifinished product which is equipped with the chip and is connected with a lead wire into packing equipment in a continuous disk tape shape, and the chip and the lead wire are packed in colloid reliably by an adhesive dripping technology to obtain a double-interface intelligent card package module provided by the proposal. Serious test shows that the double-interface intelligent card package module packed by a carrier tape method can be widely applied to the production of a double-interface card, such as the application occasions of an EMU bank card, a consumption card, etc. The double-interface intelligent card module can realize non-contact reading card from long distance.

Description

technical field [0001] The invention relates to the technical field of microelectronic semiconductor packaging, in particular to the technical field of smart card module packaging. In particular, a dual-interface smart card module and a carrier tape. Background technique [0002] With the continuous improvement of integrated circuit packaging technology, the integration level of integrated circuits is increasing day by day, and the functions are becoming more and more abundant. In the field of smart cards, due to the gradual emergence of security and multi-functional requirements, it is required to realize both the functions of contact smart cards and the functions of contactless smart cards in the same smart card product. The traditional method is to package the independent contact smart card chip and contactless smart card chip in the same package to realize two functions. But this method has many disadvantages, such as high production cost, complex process, poor reliabi...

Claims

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Application Information

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IPC IPC(8): H01L23/498G06K19/077
CPCH01L24/97H01L2224/48091H01L2924/14
Inventor 杨辉峰顾秋华
Owner SHANGHAI CHANGFENG SMART CARD
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