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Radiation solidified rubberized adhesive/sealant

A technology of radiation curing and adhesives, which is applied in the direction of adhesives, non-polymer organic compound adhesives, sealing devices, etc., and can solve problems such as hindering light emission and high melting temperature of temperature-sensitive devices

Inactive Publication Date: 2009-04-22
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These techniques do not always work: organic encapsulants may not meet stringent moisture permeation requirements; moisture impermeable solder encapsulants may have melting temperatures that are too high for temperature sensitive devices; Agent packets can prevent light from being emitted from the device—a particular problem with top-emitting OLEDs

Method used

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  • Radiation solidified rubberized adhesive/sealant
  • Radiation solidified rubberized adhesive/sealant
  • Radiation solidified rubberized adhesive/sealant

Examples

Experimental program
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Embodiment

[0027] The moisture barrier performance of an encapsulant can be evaluated by a test known as the Ca-button test, in which the time required for a thin film of calcium metal sealed into a device to decay into a calcium salt by reacting with water is measured. The longer the lifetime of the calcium metal film before decay, the lower the penetration of moisture into the device and the better the sealant / adhesive protects the device.

[0028] The calcium-button device used in these examples is shown in Figure 1, where BH is the bondline height (thickness) of the perimeter sealant / adhesive; BW is the bondline width of the perimeter sealant / adhesive; The glass is the substrate on which the calcium metal film is placed; and the lid is the glass or metal lid used to seal the resulting device.

[0029] The device is filled with N 2 assembled in the glove box. Ca thin films were first evaporated by vapor deposition on glass substrates (26 mm x 15.5 mm x 1.1 mm) (L x W x H) with a thi...

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PUM

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Abstract

A radiation-curable adhesive / sealant composition comprises a radiation- curable rubber resin, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers.

Description

[0001] This invention was made with United States Government support under Agreement No. MDA972-93-2-0014 awarded by the Army Research Laboratories. The government has certain rights in this invention. related application [0002] This application is related to US Patent Application Serial Nos. 11 / 098,115, 11 / 098,116 and 11 / 098,117. field of invention [0003] The present invention relates to radiation curable adhesives or sealants. In a preferred embodiment it relates to adhesives and encapsulants for electronic and optoelectronic devices such as organic light emitting diodes. Background of the invention [0004] It is well known that many types of packaged electronic devices require moisture protection to achieve a specified operating or storage lifetime. In particular, in order to fully protect the organic light-emitting layer, electrodes or other moisture-sensitive components, highly moisture-sensitive electronic / optoelectronic devices such as organic light-emitting ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/22C09J201/00
CPCH01L23/26C09K3/10C09J4/06C09J123/22C09K2200/061H01L23/293C08L2312/00C08L23/22C09K2200/0642C09K2200/0617C08L21/00C09K2003/1062H01L2924/0002C08L2666/02H10K50/8426H01L2924/00
Inventor 曹杰D·赫尔
Owner HENKEL KGAA
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