Method and apparatus for photo-excitation of chemicals for atomic layer deposition of dielectric film

Abstract

The invention generally provides a method for depositing materials, and more particularly, embodiments of the invention relate to chemical vapor deposition processes and atomic layer deposition processes utilizing photoexcitation techniques to deposit barrier layers, seed layers, conductive materials, and dielectric materials. Embodiments of the invention generally provide methods of the assisted processes and apparatuses, in which the assisted processes may be conducted for providing uniformly deposited material.

Description

technical field [0001] Embodiments of the invention generally provide a method of depositing materials, and more particularly, embodiments of the invention relate to the use of photoexcitation techniques to deposit barrier layers, seed layers, conductive materials, and dielectric materials. Chemical vapor deposition process and atomic layer deposition process. Background technique [0002] A substrate manufacturing process is usually evaluated by two related and important factors, namely, device yield and cost of ownership (COO). Cost of ownership, while influenced by many factors, is greatly affected by the number of substrates processed per process, ie, the throughput of the production process, and the cost of process materials. Batch processing has been found to be promising for attempts to increase capacity. However, providing uniform process conditions over an increasing number of substrates is a challenging issue. [0003] In addition to this, it has been shown that...

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Problems solved by technology

However, this process may suffer from relaxation of the plasma before it enters the processing region

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