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Hole electricity conduction method for printed circuit board

A technology for electrical conduction of printed circuit boards and holes, applied in the field of printed circuit board manufacturing, can solve problems such as electrical disconnection of through holes, and achieve the effect of reliable circuit connection

Active Publication Date: 2011-03-30
靖江德方科技服务有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a printed circuit board hole conduction method that can fully ensure the electrical conductivity of the through hole, aiming at the defect that the existing hole conduction method is easy to cause the electrical disconnection of the through hole.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Air-drying: Air-dry the laminated printed circuit board after the first black hole treatment at a temperature of 68°C;

[0023] The second black hole treatment: turn the air-dried laminated printed circuit board upside down at a temperature of 30° C. and put it into the black hole liquid for 65 seconds. The black hole liquid contains 2.6% by weight of carbon, 1.0% by weight % of salt of wormwood and 96.4% by weight of water (based on the total amount of black hole liquid);

[0024] Air-drying: Air-dry the laminated printed circuit board after the second black hole treatment at a temperature of 70°C;

[0025] Microetching treatment: The laminated printed circuit board was immersed in a sulfuric acid hydrogen peroxide microetch containing 6 vol% sulfuric acid and 2 vol% hydrogen peroxide at a temperature of 30°C for 60 seconds, and after being removed from the microetch , to clean the laminated printed circuit board;

[0026] Anti-oxidation treatment: immerse the lamina...

Embodiment 2

[0030] The first black hole treatment: put the decontaminated laminated printed circuit board into the black hole liquid for 65 seconds at a temperature of 30°C. The black hole liquid contains 5% by weight of carbon, 3.5% by weight of The water of potassium carbonate and 91.5% by weight (based on the total amount of black hole liquid);

[0031] Repeat the first black hole treatment: repeat the first black hole treatment process once;

[0032]Air-drying: Air-dry the laminated printed circuit board that has undergone the first black hole treatment twice at a temperature of 70°C;

[0033] The second black hole treatment: turn the air-dried laminated printed circuit board upside down at a temperature of 32° C. and put it into the black hole liquid for 70 seconds. The black hole liquid contains 5% by weight of carbon, 3.5% by weight % of salt of wormwood and 91.5% by weight of water (based on the total amount of black hole liquid);

[0034] Repeat the second black hole treatment:...

Embodiment 3

[0041] The first black hole treatment: put the decontaminated laminated printed circuit board into the black hole liquid for 70 seconds at a temperature of 32°C. The black hole liquid contains 8% by weight of carbon, 5% by weight of The water of potassium carbonate and 87% by weight (based on the total amount of black hole liquid);

[0042] Charge adjustment: at a temperature of 23° C., the laminated printed circuit board processed for the first black hole was immersed in an adjustment solution for 30 seconds. The adjustment solution contained 42% by weight of ethanolamine, 10% by weight of acetamide and 48% by weight of water (based on the total amount of the adjustment liquid);

[0043] Repeat the first black hole treatment: Repeat the above first black hole treatment process for the charge-adjusted laminated printed circuit board;

[0044] Air-drying: Air-dry the laminated printed circuit board that has undergone the first black hole treatment twice at a temperature of 72°...

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PUM

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Abstract

The invention discloses a method for hole conduction of a printed circuit board. The method comprises: firstly, putting a laminated printed circuit board into black hole liquor and carrying out first black hole treatment; air drying the laminated printed circuit board which is subjected to the first black hole treatment and carrying out second black hole treatment; and air drying the laminated printed circuit board which is subjected to the second black hole treatment, wherein in the process of carrying out the second black hole treatment, the laminated printed circuit board is reversed relative to the first black hole treatment. The method for the hole conduction of the printed circuit board performs two times of black hole treatments on the laminated printed circuit board, and the laminated printed circuit board is reversed and put into the black hole liquid in the process of the second black hole treatment so as to make carbon in the black hole liquid more even and densely adhered to the hole wall of the pylomes, thereby ensuring electric conductivity of pylomes on the printed circuit board with more layers, and realizing reliable connection of circuits between any two layers of the printed circuit board.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, and more specifically relates to a conductive method for through holes in the printed circuit board. Background technique [0002] Hole conduction is one of the most critical process links in the process of PCB manufacturing. For a long time, the electroless copper deposition technology has been the mainstream technology for realizing hole conductivity (hole metallization), which uses a self-catalyzed redox reaction. Although this technology has been used for many years and has been continuously improved, there are still insurmountable defects, such as incomplete electrical conduction, environmental pollution, complicated process, and high cost. [0003] Disclosed in CN1063395A is a non-chemically plated hole conductive process for manufacturing printed circuit boards, and wherein specifically discloses a black hole method, that is, by immersing a laminated printed circuit boar...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/42
Inventor 刘登志彭广福
Owner 靖江德方科技服务有限公司
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