Resin composition and copper clad laminate prepared by metal foil coated with resin composition

Abstract

The invention belongs to a chemical compound field, particularly referring to a resin compound and using the resin compound to coat a metal foil and applying a copper clad laminate made from the resin compound. The invention provides a halogen-free functional resin compound that has an excellent comparison tracking index or leakage resistance tracking characteristic, and a resin coated copper foil that is prepared by using the resin compound to coat a copper foil, namely a complex of the resin compound and the copper foil. The coated clad laminate prepared by the resin copper foil is used and has excellent comprehensive property, with the CTI of which being equal to and more than 400V. The resin compound of the invention overcomes the problems that in the prior art, the coated clad laminate with the CTI being equal to and more than 400V has dry flowers, exposed cloth marks and thickness and precision control, which is caused by the pre-leaching materials or bonding sheets when using reinforcing materials, meanwhile, product halogen free is realized, and the complex material of the resin compound and the copper foil has thinness, long storage period, flexible use and convenient management.

Description

Technical field: [0001] The invention belongs to the field of chemical compositions, and particularly relates to a resin composition, a metal foil coated with the resin composition, and a copper-clad board manufactured by using the resin composition. Background technique: [0002] At present, the comparative tracking index (Comparative Tracking Index, CTI) of ordinary copper-clad laminates is generally 175V ~ 225V, and for high-CTI copper-clad laminates, although the CTI can reach more than 400V, it uses glass fiber pre-impregnated resin. Made of halogen prepreg, which does not meet environmental control requirements due to its halogen content. The patent applications with application numbers 200610035291.3 and 200710028539.8 disclose a halogen-free resin composition and its application to resin-coated copper foil. Although they perform well in heat resistance, alkali resistance and flame retardancy, they cannot reach high Requirements for tracking index (CTI≥400V). [000...

AI Technical Summary

Problems solved by technology

[0002] At present, the comparative tracking index (Comparative Tracking Index, CTI) of ordinary copper-clad laminates is generally 175V ~ 225V, and for high-CTI copper-clad laminates, although the CTI can reach more than 400V, it uses glass fiber pre-impregnated resin. Made of halogen prepreg, which does not meet environmental control requirements due to its halogen content

The patent applications with application numbers 200610035291.3 and 200710028539.8 disclose a halogen-free resin composition and its application to resin-coated copper foil. Although they perform well in heat resistance, alkali resistance and flame retardancy, they cannot reach high Requirements for tracking index (CTI≥400V)

[0003] In addition, there are some deficiencies in the production of high CTI prepregs in the traditional CCL production method of impregnating reinforcing materials with resin composition glue, because the reinforcing materials of prepregs are not easy to soak, and the CCLs prepared by lamination are easy to There is a problem of dry flowers or exposed cloth lines; at the same time, the degree of semi-curing of the prepreg is not easy to control, which makes the fluidity of the prepreg large during the molding process of the laminated copper clad laminate, which reduces the thickness control accuracy of the copper clad laminate; The thickness of the prepreg of the reinforcement material is large, and it is very difficult to produce thin copper clad laminates, and the storage period of this prepreg is also relatively short, which is not conducive to management and control, and may easily cause material degradation

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