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Production method of integrated submissive sensor for measuring curve clearance and force

A technology for measuring curved surfaces and compliance, applied in the field of sensors, can solve the problems of unrealizable installation position and lead wire method, increased difficulty in processing, measurement and monitoring, etc., and achieve a large range, good compliance, high force-sensitivity precision and resolution. Effect

Inactive Publication Date: 2010-06-23
TSINGHUA UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Parts with thin-walled surfaces of revolution are widely used in national defense and various daily life products, and the processing, measurement and monitoring of these parts are often limited by special conditions such as the size of the space structure and the medium of the material to be measured. increased difficulty
When measuring the gap and extrusion force between the same curved surface, two kinds of sensors need to be installed, and the installation position and lead wire method are often restricted by the space structure and cannot be realized

Method used

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  • Production method of integrated submissive sensor for measuring curve clearance and force
  • Production method of integrated submissive sensor for measuring curve clearance and force
  • Production method of integrated submissive sensor for measuring curve clearance and force

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Embodiment Construction

[0039] The preparation method of the integrated compliant sensor for measuring the surface gap and force proposed by the present invention, the front plan view of the sensor before packaging during the preparation process is as follows figure 1 shown, including the following steps:

[0040] (1) Preparation of planar eddy current sensitive elements:

[0041] (1-1) Open holes 4 in rows and columns on the polyimide film substrate 1, the thickness of the polyimide film is 100 μm-200 μm, and the aperture of the holes is 250-350 μm;

[0042] (1-2) Copper foil is respectively plated on the front and back surfaces of the polyimide film substrate and the surface of the above-mentioned opening, and the thickness of the copper foil is 15 μm-20 μm;

[0043] (1-3) Photolithography is carried out to the above-mentioned reverse copper foil, and the eddy current coil 7 is formed centering on the above-mentioned opening 4, and an inner lead 3 is formed on one side of each eddy current coil 7,...

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PUM

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Abstract

The invention belongs the technical field of sensors and relates to a method for preparing an integrated compliant type sensor used for measuring curved surface gaps and force, and prepares planar electric eddy current sensitive elements and ultrathin compliant conducting polymer sensitive elements respectively by the following steps: coating the periphery of the base of a planar electric eddy current sensitive element which is stuck with an ultrathin compliant conducting polymer sensitive element with thermoset package resin by utilizing package resin location resin; and sticking another planar electric eddy current sensitive element layer on the surface to obtain an integrated compliant type sensor, while sticking, the planar electric eddy current coils the internal down-leads and the openings of the upper layer and the lower layer are opposite respectively. The sensor prepared according to the method has the advantages that the gap and the extrusion force between curved surfaces can be measured at the same time; the sensor can be stuck between surfaces of arbitrary shapes while measuring, is suitable for being mounted in narrow space while measuring, and can be applied in measuring field with high temperature, radicalization and the like; the measuring range is wide; and the measuring accuracy is high.

Description

technical field [0001] The invention relates to a preparation method of an integrated flexible sensor for measuring curved surface gap and force, and belongs to the technical field of sensors. Background technique [0002] The concept of "compliant sensor" can be traced back to the late 1980s. Many special structures in aerospace vehicles have brought great difficulties to the installation of traditional rigid sensors. People hope that the sensor has good flexibility, is not limited by the shape of the object to be measured, and can be attached to various regular or irregular surfaces to achieve normal sensing functions. After entering the 1990s, scientists in the United States, France, Japan, Switzerland, Portugal and other countries began to conduct research on compliant sensors, and many new sensor materials and structures were applied to this research field. [0003] In 2001, Professor Lumelsky, a well-known scholar in the field of sensors in the United States, put forw...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B7/14G01L1/18
Inventor 王鹏丁天怀胡颖
Owner TSINGHUA UNIV
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