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Intelligent radiator of fan and method for controlling fan revolution speed

A fan speed and heat dissipation device technology, applied in cooling/ventilation/heating transformation, instrumentation, electrical digital data processing, etc., can solve problems such as excessive energy loss, poor performance, design cost and component cost increase, and reduce the program The effect of structure and performance improvement

Inactive Publication Date: 2009-06-24
INVENTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, actual test results show that when the temperature is between T MIN with T MAX Between the two temperatures, the output power of the fan does not change linearly. At this time, it is necessary to design a complex mathematical formula to calculate the comparison between each temperature and the output power of the fan. In this way, it is necessary to To additionally set up circuit components and software that can perform this mathematical operation, the design cost and component cost will increase accordingly
In addition, using the software program to detect the temperature in a polling manner through the BIOS to adjust the fan speed, the performance is poor, and it will cause excessive energy loss.

Method used

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  • Intelligent radiator of fan and method for controlling fan revolution speed
  • Intelligent radiator of fan and method for controlling fan revolution speed
  • Intelligent radiator of fan and method for controlling fan revolution speed

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Embodiment Construction

[0037] As far as the design of current computer systems (such as personal computers, servers and workstations) is concerned, the temperature monitoring function has been listed as an important design consideration, and the monitoring of the system and CPU temperature is a very important item, and another related An important function is the control of the fan speed. The temperature of the central processing unit will change with the operation of the operating system, so the fan speed must be adjusted through the system. The following describes an embodiment of the present invention. By means of the smart fan heat dissipation device and the method for controlling the fan speed, the entire system is kept at a stable ambient temperature.

[0038] figure 2 Shown is a structural diagram of the fan cooling device of the present invention, including a temperature sensor 21 , a temperature monitoring unit 22 , a processing unit 23 , a driving unit 24 , and a fan 25 . The temperatur...

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Abstract

The invention discloses a fan radiating device and a control method for the rotational speed of a fan. The fan radiating device comprises a temperature sensor, a temperature monitoring unit, a processing unit, a drive unit, a fan and the like, wherein, the temperature monitoring unit is used for comparing the sensing result of the temperature sensor with at least one critical value, and determining whether an interrupt event is sent out according to the comparison result; the processing unit executes an interrupt service according to the interrupt event, so as to set and output the rotational speed value of the fan; and the drive unit drives and controls the rotational speed of the fan according to the rotational speed value of the fan. The fan can provide wind flow to reduce the temperature of the interior of a computer system or a central processing unit.

Description

technical field [0001] The present invention relates to a temperature control device and method, and in particular to a fan cooling device and a method for controlling the fan speed. Background technique [0002] With the rapid development of technology, the development of computer hardware has also progressed quite rapidly in recent years, such as the central processing unit (Central Processing Unit, CPU) that is used in desktop computers and notebook computers, and even servers and workstations. ), its clock pulse speed is also developing faster and faster to cope with the huge amount of data that today's users want to process, and to shorten the time for processing data. As the clock pulse speed of the central processing unit increases, its surface temperature also increases. If no device is installed to cool it down, it may lead to the risk of crashing or even destroying the hardware equipment. Therefore, the central processing unit must be The processor is cooled by a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/467G06F1/20
Inventor 张启聪卢盈志
Owner INVENTEC CORP