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Power distribution system for integrated circuits

An integrated circuit and power technology, applied in the direction of circuits, printed circuit components, electrical components, etc., can solve difficult and expensive, high-loss dielectric problems and other problems

Inactive Publication Date: 2009-06-24
特拉速率咨询集团公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] 1. Fine interval filter zero;
[0014] 2. High loss dielectric;
[0015] 3. High skin loss interconnection;
Building such a distribution system becomes difficult and expensive, if not impossible, as device performance increases in frequency and power

Method used

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  • Power distribution system for integrated circuits
  • Power distribution system for integrated circuits
  • Power distribution system for integrated circuits

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0129] Techniques for Optimizing Power Distribution Systems

[0130] Such as Figure 12 As shown in the power distribution system 100 of , these power and ground plane 111 pairs of PCB 110 can be paired together to take advantage of mutual inductance and inter-plane capacitance. These mutual inductances of the power and ground planes 111 of the PCB 110 reduce the inductance of the power distribution paths as a whole. Reducing the inductance of the power distribution path increases the power distribution bandwidth. These interplane capacitances of the power and ground planes 111 of the PCB 110 provide a small amount of energy storage, but interact with other parallel inductances within the power distribution system 100 . This point is a key parameter at high frequencies.

[0131] Capacitors 112 on PCB 110 provide energy storage within power distribution system 100 . Capacitors 112, 122, and 132 may be mounted on a substrate, which includes PCB 110, interposer 120, and IC pa...

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PUM

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Abstract

Power distribution system for integrated circuits includes methods to damp resonance between a bypass capacitor network and a power / ground cavity of the printed circuit board that (a) does not require excessive quantities of bypass / damping components or (b) does not require high plane cavity capacitance or in the alternative can insure a Q of less than 1.4 at the transition from the bypass network to the plane cavity impedance cross-over.

Description

technical field [0001] The present invention relates to power distribution for integrated circuits (ICs). More specifically, the present invention relates to power distribution for ICs connected to printed circuit boards (PCBs). Background technique [0002] In recent years, high-speed operating circuit devices have been required, and research has been conducted on them. A circuit device capable of high-speed operation will realize a drastic reduction in processing time that previously took a long time, allow processing previously thought to be impossible, and will make it possible to perform a large number of tasks using one device instead of a plurality of devices, thereby reducing Small processing costs and contribute to the development of services, facilities, functions, etc. [0003] The supply voltage to a circuit should not vary substantially over time. Even if the current consumption of the circuit does not fluctuate substantially over a short period of time, the ...

Claims

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Application Information

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IPC IPC(8): H05K1/11
CPCH01L2924/19105H01L2924/3011H01L2224/16225
Inventor 史帝夫·威耳史考特·麦克莫若
Owner 特拉速率咨询集团公司
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