Flat suction nozzle and chip fetching/laying machine as well as semiconductor test method thereof

A semiconductor, flat technology, used in semiconductor chip pick and place nozzles and chip pick and place machines and their testing fields to reduce scratches

CN101471276AInactive Publication Date: 2009-07-01KING YUAN ELECTRONICS
0 Cites 8 Cited by

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
Publication Date
2009-07-01
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention relates to a flat nozzle and chip-pick and -place machine and semiconductor test method. The flat nozzle is arranged at the chip-pick and -place machine for picking and placing semiconductor chips which have a plurality of electro-conductive projections, the flat nozzle comprises a nozzle body, at least one gas channel and a contacting portion, the gas channel has an opening on the contacting portion for adsorbing semiconductor chips, the contacting portion can cross a plurality of electro-conductive projections on the chips, the chip-pick and -place machine comprises a mechanical arm and at least one flat nozzle sleeved at the machine arm to pick and place the semiconductor chips with a plurality of electro-conductive projections, and the semiconductor test method is characterized in that a semiconductor chip is absorbed by the flat nozzle and the semiconductor chip is placed in a box disc. The invention can not only avoid from scoring chip projections, but also the chip design cannot waste the limited area of chips due to the restricted picking and placing, which can be extensively applied to various chips and various semiconductor seal-measure methods and reduce the scoring of chips when in picking and placing.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to a semiconductor chip pick-and-place suction nozzle, a chip pick-and-place machine and a testing method thereof, in particular to a flat suction nozzle, a chip pick-and-place machine capable of avoiding chip bumps being scratched, and a semiconductor testing method thereof. Background technique

[0002] With the advancement of semiconductor technology, electronic components using Flip Chip Interconnect Technology have gradually become the mainstream of future miniaturization and lightweight electronic components. This technology utilizes conductive bumps on chips (chips or wafers, which are referred to herein as chips) for electrical and structural connections. During the chip transfer process, the conductive bumps are scratched.

[0003] see Figure 1A and Figure 1B Shown are respectively the side view schematic diagram and the bottom view schematic diagram of the conventional suction nozzle. The existing known suction nozz...

Examples

Embodiment Construction

[0042] In order to further illustrate the technical means and effects that the present invention adopts to achieve the intended invention purpose, below in conjunction with the accompanying drawings and preferred embodiments, the flat suction nozzle, the chip pick-and-place machine and the semiconductor testing method thereof proposed according to the present invention will be described. The specific embodiment, structure, test method, steps, features and effects thereof are described in detail below.

[0043] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of preferred embodiments with reference to the drawings. Through the description of the specific implementation mode, when the technical means and functions adopted by the present invention to achieve the predetermined purpose can be obtained a deeper and more specific understanding, but the accompanying drawings ar...