Sealing-off device for ball lattice array packaging module and sealing-off method thereof

Abstract

The invention relates to a sealing-off device for a ball grid array type encapsulation module, which can detach a chip module from a circuit board. The sealing-off device comprises a heat source, at least one radiating piece and an accepting tank, wherein the heat source is used for heating towards the chip module, the radiating piece is conjoint with the other circuit components round the chip module, and cooling agent is arranged in the accepting tank. When the heat source is used for heating the chip module, the radiating piece can effectively reduce the temperature of the circuit components.

Description

technical field [0001] The invention relates to a spherical array packaging module, in particular to a desoldering device and method capable of avoiding thermal damage or short circuit of electronic components around the chip module to be detached. Background technique [0002] Ball Grid Array (BGA) package refers to a chip module soldered to a printed circuit board by using a plurality of solder bumps arranged in an array, and these solder bumps As the packaging technology for the input / output end of the chip module; in recent years, ball grid array packaging has gradually replaced the traditional leadframe (Leadframe) as the chip module support and the driving trend of the input / output end technology. [0003] In the manufacturing process, when the soldered chip module is found to be unable to operate normally, the engineer needs to carry out rework (rework), that is, to soften and loosen the solder ball bumps on the bottom side of the chip module by heating, and then the ...

AI Technical Summary

Problems solved by technology

[0003] In the manufacturing process, when the soldered chip module is found to be unable to operate normally, the engineer needs to carry out rework (rework), that is, to soften and loosen the solder ball bumps on the bottom side of the chip module by heating, and then the chip module Disassemble and overhaul, and then re-solder the good product to the circuit board; however, during the heating process, the capacitors around the chip module often cause the internal electrolyte to flow out due to heating, resulting in capacitor damage, and other adjacent chip modules It is also often caused by a short circuit or collapse due to the softening and loosening of the solder ball bumps on the bottom side. As a result, the surrounding circuit components that were originally in normal operation also need to be repaired together, which greatly increases the manpower and cost required for repair.

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