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Radiator for high-power LED lamp

An LED lamp, high-power technology, applied in electric solid-state devices, semiconductor devices, lighting and heating equipment, etc., can solve the problems of shortening the life of LED lamps, not easy to dissipate heat, and bulky lamps, so as to improve market competitiveness, Reduce cost and small size

Inactive Publication Date: 2009-07-15
HONGLI LIGHTING GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Existing LED lamps mostly use multiple LED light sources to install on the heat dissipation substrate, and the heat dissipation substrate is mostly flat. Since the light source of the LED lamp requires the heat of the chip to be dissipated quickly, otherwise the LED light source will accumulate heat, making the light source Luminous decay occurs, which shortens the life of LED lamps. Using a heat sink with this structure, the heat is not easy to dissipate, and the heat dissipation area is small. If the heat dissipation area is increased, the volume of the lamp will increase, and the price of the lamp will increase.

Method used

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  • Radiator for high-power LED lamp

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Embodiment Construction

[0010] A heat sink for high-power LED lamps, including a heat dissipation substrate 3 and a plurality of heat dissipation fins 2 on it, the heat dissipation substrate 3 is in the shape of a cylindrical ring, and the outside of the cylindrical ring-shaped heat dissipation substrate 3 is evenly distributed with multiple groups of straight-toothed heat dissipation fins. The fins 2 and both sides of the heat dissipation fins 2 are provided with serrated grooves, and the inner center of the cylindrical ring-shaped heat dissipation substrate 3 is provided with a heat dissipation base 1 for installing a high-power LED light source. The heat dissipation base 1 is connected with the heat dissipation The substrate 3 is connected by a plurality of heat dissipation ribs 4 , and the shape of the heat dissipation base 1 matches the aluminum substrate of the high-power LED, and is usually designed as a circle or a square.

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Abstract

The invention provides a radiator for large-power LED lamps, belonging to the field of LED lamps and lanterns. The radiator comprises a cylinder ring-shaped radiating substrate and a plurality of radiating fins arranged on the substrate; a plurality of radiating fin groups are evenly distributed outside the cylinder ring-shaped radiating substrate; a radiating base installed with a large-power LED light source is arranged at the internal center of the cylinder ring-shaped radiating substrate; the radiating base and the radiating substrate are connected by a plurality of radiating ribs. In the device, the radiating area is enlarged, the radiating rate is accelerated, the requirement for radiating of the LED source is met, the service life is prolonged, the volume of the radiator is small, the manufacturing cost of the lamps and lanterns is lowered and the market competitiveness of the LED lamps and lanterns is enhanced.

Description

technical field [0001] The invention belongs to the field of LED lamps, in particular to a radiator for high-power LED lamps. Background technique [0002] LED (light emijjing diode) has the advantages of long life, high luminous efficiency, no radiation, low power consumption, etc. It is an energy-saving and environmentally friendly product; high-power LED adopts integrated packaging technology, with higher luminous efficiency, greater power, and small size, so it Power LED lamps are also emerging. [0003] Existing LED lamps mostly use multiple LED light sources to install on the heat dissipation substrate, and the heat dissipation substrate is mostly flat. Since the light source of the LED lamp requires the heat of the chip to be dissipated quickly, otherwise the LED light source will accumulate heat, making the light source Luminous decay occurs, which shortens the life of LED lamps. Using a radiator with this structure, the heat is not easy to dissipate, and the heat d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/00H01L23/367F21Y101/02F21V29/50F21V29/74
Inventor 吕国峰
Owner HONGLI LIGHTING GRP
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