Forerunner composition of polyimide and method for preparing polyimide

A polyimide and composition technology, applied in the field of polyimide precursor composition, can solve the problems of time-consuming manufacturing process, side chain damage, safety problems, etc.

Active Publication Date: 2009-07-29
ETERNAL MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the composition is limited only to imidization by heating
Generally speaking, the thermal imidization method requires several hours of heating at a high temperature of 250°C to 350°C to obtain 100% imidiza

Method used

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  • Forerunner composition of polyimide and method for preparing polyimide
  • Forerunner composition of polyimide and method for preparing polyimide
  • Forerunner composition of polyimide and method for preparing polyimide

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0116] 2.181 grams (0.01 moles) of pyromellitic dianhydride (pyromellitic dianhydride, hereinafter referred to as PMDA) were dissolved in 200 grams of N-methyl-2-pyrrolidinone (N-methyl-2-pyrrolidinone; hereinafter referred to as NMP), The resulting mixture was heated to 50°C and the reaction was stirred for two hours. 2.322 g (0.02 mol) of 2-hydroxyethyl acrylate (2-Hydroxyethyl acrylate, hereinafter referred to as HEA) was added dropwise, and reacted and stirred at a constant temperature of 50° C. for two hours. Thereafter, 20.024 grams (0.1 mole) of 4,4'-oxidized dianiline (4,4'-oxy-dianiline, hereinafter referred to as ODA) was added to the solution, and after it was completely dissolved, 18.0216 grams (0.09 mol) of PMDA, reacted and stirred for six hours at a constant temperature of 50°C. Then 3.243 g (0.02 mol) of N, N'-carbonyldiimidazole (N, N'-Carbonyldiimidazole; CDI) was added, and the reaction was stirred at a constant temperature of 50° C. for one hour.

Embodiment 2

[0120] 2.181 grams (0.01 mol) of PMDA were dissolved in 200 grams of NMP, heated to 50°C and the reaction was stirred for two hours. 2.60 g (0.02 mol) of 2-hydroxyethyl methacrylate (2-hydroxyethyl methacrylate; hereinafter referred to as HEMA) was slowly added dropwise, and the reaction was stirred at a constant temperature of 50° C. for two hours. Add 20.024 g (0.1 mole) of ODA to the solution, and after it is completely dissolved, add 18.0216 g (0.09 mole) of PMDA, react and stir for six hours at a constant temperature of 50°C. Then add 3.243g (0.02mol) of CDI, react and stir at a fixed temperature of 50°C for one hour.

Embodiment 3

[0122] 2.181 grams (0.01 mol) of PMDA were dissolved in 200 grams of NMP, heated to 50°C and the reaction was stirred for two hours. 2.322 g (0.02 mol) of HEA was slowly added dropwise, and the reaction was stirred at a constant temperature of 50° C. for two hours. Add 10.814 grams (0.1 moles) of p-phenylenediamine (para-phenylenediamine, hereinafter referred to as pPDA) to the solution, and after it is completely dissolved, add 18.0216 grams (0.09 moles) of PMDA, and react with stirring at a constant temperature of 50°C six hours. Then add 3.243g (0.02mol) of CDI, react and stir at a fixed temperature of 50°C for one hour.

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Abstract

The invention provides a precursor composition of polyimide and a method for preparing the polyimide. The precursor composition of polyimides contains amic acid low polymer of sentence type (I) and dicarboxylic anhydride derivative at the end with ester group (-C(O)OR) and carboxyl(-C(O)OH) of sentence type (II); wherein, R, G, G1, P, D and m are ones defined in the article. The invention also provides the polyimide synthesized by the precursor composition.

Description

technical field [0001] The present invention relates to a polyimide (polyimide, PI for short) precursor composition, and the present invention also relates to the application of the composition in the preparation of polyimide. Background technique [0002] Polyimide has always been the first choice for high-performance polymer materials due to its excellent thermal stability and good mechanical, electrical and chemical properties. In addition, due to the higher and higher requirements on the characteristics of semiconductors, while traditional inorganic materials have their application limits and shortcomings, the characteristics of polyimide can make up for the shortcomings of traditional materials in some aspects. Therefore, when DuPont's aromatic polyimide technology was developed, it received widespread attention, and many polyimides with multiple uses were developed. [0003] In the semiconductor industry, polyimide is widely used in passivation film, stress buffer fil...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08G73/12
Inventor 吴仲仁郑弼仁
Owner ETERNAL MATERIALS CO LTD
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