Metal mold for injection molding and semiconductor package formed therewith and method of manufacturing semiconductor package

An injection molding, semiconductor technology, applied in the direction of semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of easy to produce weld lines, unfilled molding, short shots, etc.

Active Publication Date: 2009-08-05
NICHIA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that when the thinner region becomes the final filling position where the two resin flows meet, a weld line is likely to occur, and the molten resin is in a state where it is difficult to flow, resulting in a short shot, which is a failure of molding without filling.
After the package thickness limit is determined, the die size needs to be reduced correspondingly, but especially under the conditions of the size and input power required by the side-emission light emitting device, the smaller the die size, the darker it will be.

Method used

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  • Metal mold for injection molding and semiconductor package formed therewith and method of manufacturing semiconductor package
  • Metal mold for injection molding and semiconductor package formed therewith and method of manufacturing semiconductor package
  • Metal mold for injection molding and semiconductor package formed therewith and method of manufacturing semiconductor package

Examples

Experimental program
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Effect test

Embodiment approach 1

[0050] exist image 3 ˜ FIG. 7 show the appearance of the semiconductor package 100 according to Embodiment 1 of the present invention. In these figures, image 3 is a perspective view showing the semiconductor package 100 viewed obliquely from above, Figure 4 It is a perspective view showing obliquely downward viewing from the front, Figure 5 It is a perspective view showing obliquely upward observation from the rear, Figure 6 It is a perspective view showing obliquely downward observation from the rear, Figure 7A represents the main view, Figure 7B represents the rear view, Figure 7C It is a side view showing a section of the box-shaped block 11 (front-side sealing). The semiconductor package 100 shown in these figures is a side-emission type light-emitting device using a semiconductor light-emitting element 30, and includes: a resin-molded package body 10 thinner than its width; external electrodes 50 .

[0051] (lead frame 20)

[0052] A lead frame 20 is bur...

Embodiment approach 2

[0083] In addition, the shape of the semiconductor package is not limited to the above configuration, and various configurations can be used. As an example, in Figure 12 to Figure 15 An example of the semiconductor package 200 in which the shape of the external electrodes of the second embodiment is changed is shown in . In these figures, Figure 12 is a perspective view showing the semiconductor package 200 viewed obliquely from above, Figure 13 It is a perspective view showing obliquely downward viewing from the front, Figure 14It is a perspective view showing obliquely upward observation from the rear, Figure 15 It is a perspective view showing obliquely downward viewing from the rear. The semiconductor package 200 shown in these figures is also the same as the first embodiment, and is a side-emission light-emitting device using a semiconductor light-emitting element, and the same reference numerals are assigned to common components, and detailed description thereof...

Embodiment 1

[0103] As Example 1, produced such as Figure 16 The shown injection molding mold 60 is composed of a fixed mold 61 , a movable mold 62 , and a mold insert 63 . The gate 65 formed on the fixed mold 61 gradually becomes thinner from the side of the runner 64 to the side of the cavity 68 to the top of the cavity 68 , and passes through from the top of the cavity 68 within the range that does not exceed the outermost contour of the movable mold 62 . , extending to the side of the fixed mold 61, obtaining a size to become the outermost contour in one direction, and extending to the joint surface 108 of the fixed mold 61 at the same time. By adopting such a shape of the gate 65 , it is possible to have a gate with the largest diameter when manufacturing a semiconductor package of the same shape with the injection mold 60 . The larger the gate diameter Φd1, the longer the time for the molten resin JS to cool and solidify. Therefore, the injection molding die 60 can be the most diff...

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Abstract

A metal mold for injection molding a semiconductor package includes a fixed mold member and a plurality of movable mold members each having an inner surface collectively defining a mold cavity when closed, the fixed mold member or the plurality of movable mold members has a gate 65 continuous to the inner surface defining the cavity through which a resin is injected into the cavity to form a semiconductor package 100. The inner surface of the plurality of the movable mold members has a first mold surface and a second mold surface facing each other and tapering toward the gate 65, and the first mold surface or the second mold surface has a recess adjacent to the gate. A large gate opening enables injection under a lower in-mold pressure and generation of burrs can be prevented and stable resin molding can be obtained.

Description

technical field [0001] The present invention relates to a mold for injection molding, a semiconductor package formed by the same, and a method for manufacturing the semiconductor package. Specifically, it relates to a mold for injection molding suitable for manufacturing thinner semiconductor packages, a semiconductor package molded by the same, and the production of the semiconductor package. method. Background technique [0002] An injection molding method is known as a manufacturing technique for packages used in semiconductor devices. In the injection molding method, the heated and melted resin is injected into the cavity from the gate through the sprue and runner of the mold, and then cooled and solidified for a predetermined period of time to produce a molded body. In this method, when the shape of the resin molded body has a thicker part and a thinner part, the thinner part is cooled quickly, and the molten resin is easily cooled and solidified. Therefore, there is ...

Claims

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Application Information

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IPC IPC(8): H01L21/56H01L23/28B29C45/26H01L33/32H01L33/48H01L33/56H01L33/62
CPCH01L2924/0002H01L33/52B29C2033/422H01L33/486B29C45/0046B29C45/14655B29C33/42B29C45/14065B29C2045/0027H01L33/62B29C45/2708H01L2933/0033H01L2924/00
Inventor 山本才气
Owner NICHIA CORP
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