Protective film coating method of electronic product casing

Abstract

The invention relates to a method for attaching a protective film to the shell of an electronic product. The adopted scheme is as follows: the first step: according to the size of the area where the film is to be pasted on the shell of the electronic product, cut a specific length of the protective film; the second step: provide a mold , the upper part of the lower mold is provided with a pit similar to the shape of the electronic product shell, and a number of air holes are opened in the pit, and the protective film is placed on the lower mold so that a cavity is formed between the protective film and the lower mold. The cavity is evacuated so that the protective film is adsorbed on the surface of the pit; the third step: place the electronic product casing on the protective film and in the pit of the lower mold; the fourth step: provide an upper mold, the upper The lower part of the mold is similar to the shape of the electronic product shell, and the upper mold and the lower mold are closed to pressurize the space between the electronic product shell and the protective film, and the protective film evenly covers the electronic product shell; the fifth step: remove the periphery of the electronic product Excess protective film.

Description

technical field [0001] The invention relates to a film pasting method, in particular to a method for pasting a protective film on the shell of an electronic product. Background technique [0002] At present, the casings of 3C products (communication products, computer products, consumer electronics, etc.) are generally made of smooth engineering plastics, and the casings of electronic products are easily damaged during transportation and assembly of electronic products. The scratches caused by these scratches will affect the appearance and sales of consumer electronics products. Since these scratches are difficult to recover, electronic products with scratched shells may be sent for repairs and replaced with new shells, or therefore lowered This will undoubtedly increase the cost of the product or reduce the profit. [0003] In order to overcome the above shortcomings, usually after the casing of the electronic product is produced, a layer of protective film will be applied...

AI Technical Summary

Problems solved by technology

This method of operation has several disadvantages: first, this method can only apply a protective film to one surface (and must be flat) of the electronic product casing, but cannot protect the side of the casing; second, the artificial film is more efficient. Low, it is difficult to unify the cut size of the protective film, the location of the sticking, etc.; in addition, the shell of the electronic product is often provided with some screw holes or card slots due to assembly requirements, and the protective film should be mounted on the electronic product. Expose these reserved positions to facilitate the development of subsequent work

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