Automatic test packing machine for electronic component

Abstract

The invention discloses a machine for automatic testing and packing of electronic devices and components, which features high degree of automation and efficiency as well as compact structure. The machine comprises a protective cabinet (1) and an electric cabinet (2), wherein, the upper end surface of the protective cabinet (1) is provided with an automatic testing device and a finished product packing device which are used for carrying out the work procedures such as testing, processing unqualified products, packing finished products and the like on the electronic devices and components; the work procedures are tight and ordered, and have the advantages of high degree of automation and efficiency as well as rapid package. The machine can be widely applied to the field of testing and packing of the electronic devices and components.

Description

technical field [0001] The invention relates to an automatic testing and packaging machine for electronic components. Background technique [0002] The advancement of science and technology promotes the improvement of productivity and the development of society; the electronics industry is one of the industries with the strongest development momentum. Electronic products can be seen everywhere in daily life and work, so the vast market has bred unlimited business opportunities and huge The demand is both an opportunity and a challenge; to seize the market depends on strength, and the core of competitiveness is technology, so technological innovation is the key to industrial development. The production of electronic components occupies a large part in the electronics industry, and the production technology of electronic components is becoming more and more mature. However, the electronic products produced need to be fully tested to ensure their quality and be properly package...

AI Technical Summary

Problems solved by technology

In the prior art, the "point-to-point" testing and packaging methods are mostly adopted, that is, a produced product is placed on a designated testing point for testing, and after the test is completed, it is placed at the packaging point for packaging, and then Put another product to the test point and package for testing and packaging. This method of testing and packaging is slow, has a low degree of automation, and takes too long to test. In addition, the testing process of the prior art is cumbersome, so the efficiency is low, which is unfavorable. Shorten the production cycle, which restricts productivity to a certain extent

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