LED street lamp heat radiation method and LED street lamp

A technology of LED street lamp and heat dissipation method, which is applied to circuits, lighting and heating equipment, cooling/heating devices of lighting devices, etc., can solve the problems of increasing the heat dissipation area, increasing the weight of lamps, increasing the cost of lamps, etc. Extend the service life and enhance the effect of radiation heat dissipation

Inactive Publication Date: 2009-08-19
河源市粤兴实业有限公司
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

Increase the heat dissipation area, which greatly increases the weight of the lamp. The weight of the popular LED street lamps on the market is two to three times that of the existing street lamps. Some street lamps weigh more than 20kg, which is extremely unfavorable to the safety performance of the street lamps. Lamp cost; at the same tim

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  • LED street lamp heat radiation method and LED street lamp

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Embodiment Construction

[0014] The LED street lamp cooling method of the present invention comprises the following steps:

[0015] a. Coat the outer surface of the PCB board with a layer of radiation cooling paint;

[0016] b. Install the LED on one side of the PCB board, and make the heat dissipation metal part of the LED base close to the PCB board 2;

[0017] c. Stick the other side of the PCB board closely to the inner surface of the lamp housing to form an LED street lamp.

[0018] The radiation cooling paint is ZS-411 radiation cooling paint.

[0019] like figure 1 As shown, the LED street lamp of the present invention includes a lamp housing 1 made of metal material, with a heat sink on the lamp housing 1, a PCB board 2 is arranged inside the lamp housing 1, and the PCB board 2 The outer surface is provided with a radiation heat dissipation cooling paint layer 3, and the radiation heat dissipation cooling paint layer 3 is "ZS-411" radiation heat dissipation cooling paint, which has good cor...

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Abstract

The invention discloses a heat dissipation method for LED street lamps and an LED street lamp. The method comprises the steps as follows: a. the external surface of a PCB board is coated by a layer of radiation heat-dissipation temperature-reduction coating; b. an LED is arranged on one surface of the PCB board and the heat-dissipation metal part of the LED base is closely clung to the PCB board; c. the other surface of the PCB board is closely clung to the internal surface of the lamp shell, thus being assembled to form the LED street lamp. The LED street lamp comprises a lamp shell with a thermal slug; the lamp shell is internally provided with the PCB board; the external surface of the PCB board is provided with the radiation heat-dissipation temperature-reduction coating layer; one surface of the PCB board is clung to the internal surface of the lamp shell and the other surface thereof is provided with a plurality of LEDs. The heat dissipation method comprises the following heat dissipation paths sequentially: LED, PCB board, radiation heat-dissipation temperature-reduction coating layer, lamp shell and outside of the lamp body; the directional heat dissipation processing technology leads the heat generated when the LED runs to be conducted quickly from the substrate to the lamp shell 1, thus leading the inside and outside of the lamp body to be arranged in a heat balance quickly, and not only prolonging the service life of the lamp, but also reducing the cost of the lamp, lightens the weight of the lamp, and also reducing the cost simultaneously.

Description

technical field [0001] The invention belongs to the technical field of lighting fixtures, and in particular relates to an LED street lamp using a light emitting diode as a light source and a heat dissipation method thereof. Background technique [0002] Like traditional light sources, semiconductor light-emitting diodes (LEDs) also generate heat during operation, the amount of which depends on the overall luminous efficiency. Under the action of external electric energy, the radiative recombination of electrons and holes produces electroluminescence, and the light radiated near the P-N junction needs to pass through the semiconductor medium and packaging medium of the chip (chip) itself to reach the outside world (air). Considering the current injection efficiency, radiative luminescence quantum efficiency, and chip external light extraction efficiency, a considerable part of the energy is mainly converted into heat energy in the form of lattice vibrations that occur through...

Claims

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Application Information

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IPC IPC(8): F21V29/00F21V19/00H01L23/373F21W131/103F21Y101/02F21V29/85F21Y115/10
CPCY02B20/72
Inventor 刘东方
Owner 河源市粤兴实业有限公司
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