Method for depositing semi-conductor film on substrate by using close-space sublimation technology and device thereof
A near-space sublimation and semiconductor technology, which is applied in vacuum evaporation plating, ion implantation plating, gaseous chemical plating, etc., can solve potential safety hazards, changes in the microstructure and photoelectric properties of cadmium telluride thin films, and the inability of thin film uniformity Control and other issues to achieve the effect of effective control of uniformity
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[0027] see figure 1 The semiconductor thin film vacuum deposition device 10 includes a semiconductor material supply device 20 and a vacuum deposition chamber 14. The structure of the semiconductor material supply device 20 and the details of the vacuum deposition chamber 14 are described in detail later. Two different methods were tried to deposit semiconductor material on the glass substrate 60 to form the semiconductor thin film. One way is to place the substrate 60 on the top of the crucible 32 until the thickness of the semiconductor film reaches the requirement; another way is to deposit the semiconductor material on the substrate transported on the conveyor belt 36 to form a semiconductor film, and the substrate is together with the metal conveyor belt 36 move.
[0028] The film vacuum deposition device 10 is used for depositing a semiconductor film with special functions on the glass substrate 60 , for example, cadmium sulfide and cadmium telluride films in cadmium su...
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