A modified structure for press mounting and positioning of semiconductor element and heat pipe radiator base plate

Abstract

The present invention discloses a modified structure for press mounting and positioning of semiconductor element and heat pipe radiator base plate, wherein it consists of heat pipe radiator base plate, semiconductor element, external conducting connection plate fixed onto the base plate, and elastic press mounting module that fastens base plate and semiconductor element; the elastic press mounting module is fixed onto the rectifying device through the support component on it; the heat pipe radiator base plate is located in the space formed by the fastening screws in the elastic press mountingcomponent; on the heat pipe radiator base plate, a positioning component is provided to match the center hole of the semiconductor element, and on the external conducting connection plate, there is at least one through hole for fastening screw. This structure may significantly reduce the dimensions of the heat pipe radiator base plate. Thereby copper with great thermal conductivity may be adopted, no static friction will be generated between the screw and the base plate, and pressure can be completely transferred to the contact surface, thus remarkably reducing thermal contact resistance.

Description

technical field [0001] The invention belongs to the heat dissipation technology of a power device of a locomotive rectifier, and in particular relates to an improved press-fit positioning structure of a semiconductor element and a heat pipe radiator substrate. Background technique [0002] Semiconductor components are used as switching devices in high-power rectifiers for locomotives. In order to reduce the number of parallel components of a single bridge arm, large components tend to be used. For example, the rectifier for electric locomotives uses six 2-inch thyristors in series and parallel for one bridge arm. , Up to now, only one 5-inch thyristor is used for one bridge arm, and the heating power consumption of a single semiconductor element reaches several thousand watts. Therefore, the supporting heat sink is required to have a higher heat dissipation capacity, and at the same time, the contact thermal resistance between the semiconductor element and the heat sink must...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem of large contact thermal resistance caused by the press-fit positioning method of the existing high-power components and the heat pipe radiator, and to provide an improved press-fit positioning of the semiconductor element and the heat pipe radiator substrate The structure can significantly reduce the contact thermal resistance, and best meet the heat dissipation requirements of high-power semiconductor components on locomotive rectifiers

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