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Diamond dice and method for producing wire using diamond dice

A technology of a diamond wire drawing die and a manufacturing method, which is applied in the direction of the wire drawing die, etc., can solve the problems of insufficient lubrication effect, poor straightness, and reduced quality.

Inactive Publication Date: 2009-09-30
ALLIED MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In wire drawing using such a lubricating material, the lubricating effect is insufficient in the diamond wire drawing die of Patent Document 1, and the life of the diamond wire drawing die becomes short.
In addition, simply by forming a shape that is easy to supply the lubricating material, the straightness during wire drawing will be deteriorated, the wire rod will be deformed, and the quality will be reduced.

Method used

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  • Diamond dice and method for producing wire using diamond dice
  • Diamond dice and method for producing wire using diamond dice
  • Diamond dice and method for producing wire using diamond dice

Examples

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Embodiment 1

[0042] About the present invention and the conventional diamond wire drawing die, making has Figure 1 to Figure 4 (the present invention) and Figure 5 (Conventional Example) A diamond wire drawing die with the hole shape shown. Three types of wire diameters Φ are produced: 15 μm, 30 μm, and 50 μm. In addition, a diamond of 1.0 mm was used for the thickness (length in the axial direction) of the diamond 1 .

[0043] Using these diamond wire drawing dies, wire drawing is performed on tungsten wire, stainless steel wire, and copper wire respectively. The specifications and experimental results of the diamond wire dies of the present invention and conventional examples are shown in Tables 1 to 12 according to differences in wire rods, wire diameters, and crystal orientations of diamond.

[0044] The crystal orientation indicates the crystal orientation of the plane in the direction perpendicular to the axis 15 of the hole, that is, the upper surface and the lower surface of the ...

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PUM

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Abstract

The present invention discloses a diamond dice that has a bearing region touching a wire inserted via an inlet, a reduction region arranged on the inlet side continuously to the bearing region, and a sidewall defining a hole extending from the inlet to the outlet along the axis so as to penetrate the bearing region and the reduction region. A wire inserted into the hole via the inlet is drawn out from the outlet via the bearing region. Assuming the inside diameter of the hole is D in the bearing region, a line connecting a first point on the sidewall located closer to the inlet side by a length of 1.0D in the axial direction of the hole than the boundary portion between the bearing region and the reduction region, and a second point on the sidewall located closer to the inlet side by a length of 3.0D in the axial direction of the hole than the boundary portion between the bearing region and the reduction region makes an angle Thema 1 of 15-30 degrees with respect to the axial direction on a cross-section appearing when the diamond dice is cut on a plane parallel with the axis and including the axis. The boundary portion between the bearing region and the reduction region has a curved surface.

Description

technical field [0001] The invention relates to a diamond wire drawing die for wire drawing, more precisely, the invention relates to a diamond wire drawing die suitable for hot wire drawing such as tungsten wire. Background technique [0002] Conventionally, diamond wire dies using natural diamond, artificial single crystal diamond, and sintered diamond are known as tools for wire drawing. In these diamond drawing dies, a die body made of diamond is integrally held by a metal case such as stainless steel, and a hole through which a wire rod is passed is formed in the diamond portion to perform wire drawing. As an example of such a diamond wire drawing die, for example, there are Figure 5 A diamond drawing die with holes of the shape shown. As a hole processing method, there is a method in which a hole is drilled with a laser, and the hole is ultrasonically polished using grinding, so that the inner surface of the hole can be finished into a predetermined shape. [0003] ...

Claims

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Application Information

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IPC IPC(8): B21C3/02
CPCB21C3/025B21C3/04
Inventor 汤川实
Owner ALLIED MATERIAL
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