Energy-efficient semiconductor plastic package die

Abstract

The invention discloses an energy-efficient semiconductor plastic package die, wherein the upper central casting plate of the upper die box (8) and the lower central casting plate of the lower die box (9) form a closed cavity; the upper die box (8) and the lower die box (9) are provided with gel passages (24) which are hollow pipelines connected with the flow passage (25); the gel passages (24) are connected with an integrated component cavity (26) via the flow passage (25); the casting head (4) is connected with the cavity; the liquid resin of the feeding cylinder (31) is infused via the flow passage and the flow passage (25) by the casting head. The invention overcomes the disadvantages of long casting process of current technology, bad air tightness of plastic-casting products, and complication of insert and mandril exchange. The invention provides a semiconductor plastic package die with large density, convenient disassembly and little plastic package material waste, saves 15%-30% resin, and improves utilization rate of the raw material, which can be applied in the field of IC package.

Description

technical field [0001] The present invention relates to injection molding equipment, in particular to packaging equipment for integrated circuits Background technique [0002] Semiconductor integrated circuit packaging molds are essential key process equipment for microelectronic packaging production. The rapid development of the microelectronics industry has put forward high-level high-tech requirements for the design and manufacture of semiconductor packaging molds. [0003] The requirements of the semiconductor packaging mold industry for molds are: first, the molds are required to be finished. At present, electronic products are continuously integrated and miniaturized, and the products tend to be high-end, and the size is getting smaller and smaller. The higher the value, the higher the precision requirements for the mold. The plastic molding process is one of the most important process means in the post-production process of semiconductor devices. Single-cylinder pack...

AI Technical Summary

Problems solved by technology

However, this kind of multi-injection head circuit packaging mold for large cakes still has waste materials, and the replacement of inserts and ejector pins is complicated and takes a long time. At the same time, the waste of materials in single-day cylinder injection molding is even more serious.

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