Circuit base plate and manufacturing method thereof

A technology of circuit substrate and manufacturing method, which is applied in the direction of printed circuit manufacturing, printed circuit, printed circuit, etc., can solve the problems of large difference in expansion and shrinkage, easy peeling of conductive lines and substrates, warping of circuit board products, etc. Achieve the effects of avoiding impact, good electrical conduction, and not easy to warp
CN101553084AActive Publication Date: 2009-10-07AVARY HLDG (SHENZHEN) CO LTD +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
AVARY HLDG (SHENZHEN) CO LTD
Publication Date
2009-10-07

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Abstract

The invention provides a circuit base plate which comprises base materials and a conductive circuit formed on the surface of the base plate, wherein the conductive circuit comprises a compound of a carbon nano tube and metal nano-particles as well as a metal plated on the surface of the compound. The plating metal is filled in a clearance between two adjacent metal nano-particles so as to cause the two metal nano-particles to be completely combined by the metal, thus realizing good electric conduction. The invention also provides a manufacturing method of the circuit base plate. The circuit base plate has good conductivity, and the difference of expanding and shrinkage degree between the conductive circuit and the base materials is reduced.
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Description

technical field

[0001] The invention relates to the technical field of inkjet printing, in particular to a circuit substrate and a method for manufacturing the circuit substrate. Background technique

[0002] As a printing process, inkjet printing (also called: inkjet printing) can be used for graphic transfer just like lithographic printing and screen printing. Inkjet printing is a non-contact printing process. It does not need to print the surface like movable type and printing plates or films made by photographic methods. It only needs to directly give the required graphics by the computer, and then control the nozzles of the inkjet printing system through the controller. , the ink particles are ejected from the nozzle and form graphics point by point. Inkjet printing can be applied in the production of circuit board circuits, that is, inkjet printed circuit graphics. The method for producing circuit graphics can accurately control the position and width of the circuit,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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