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Light-curable adhesive with shock absorption property

A light-curing and adhesive technology, applied in adhesive types, polyurea/polyurethane adhesives, adhesives, etc., can solve poor shock-absorbing ability, loose bonding of diaphragm and coil, and affect the quality performance of micro-acoustic devices and other problems, to achieve the effect of improved shock absorption performance and good shock absorption effect

Inactive Publication Date: 2009-10-21
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, ordinary light-curing adhesives have poor shock-absorbing ability. In some applications, the high temperature generated by high-frequency vibration will loosen the bonding of the diaphragm and coil, resulting in noise, which seriously affects the quality performance of micro-acoustic devices.

Method used

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  • Light-curable adhesive with shock absorption property

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Example 1, first take 135 g of hydroxyl-terminated polybutadiene diols with a molecular weight between 1500 and 4500 and an average functionality of 2, remove water at 107.5°C for 3 hours under vacuum conditions, and then cool it down to 45°C Then stop vacuuming, add 10.9g of difunctional isocyanate TDI, stir rapidly, after the temperature is stable, slowly raise the temperature and control it to 80°C for 2.5 hours, cool down to 45°C after the reaction is complete, add 5.3g of hydroxyethyl acrylate , and add 0.05g of hydroquinone as a polymerization inhibitor, slowly heat up to 75°C and react for 2.5 hours. After the reaction is complete, vacuum degassing for 0.5h, take the material to obtain polybutadiene type polyurethane modified acrylate, seal and store away from light spare;

[0017] Accurately weigh 45g of the above-mentioned polybutadiene polyurethane modified acrylate, 20g of isobornyl acrylate, 20g of N,N-dimethylacrylamide, 5g of isooctyl acrylate, 5g of photo...

Embodiment 2

[0018] Example 2, first take 100 g of hydroxyl-terminated polybutadiene diols with a molecular weight between 1500 and 4500 and an average functionality of 2, remove water for 4 hours under vacuum at 100 ° C, and then cool it down to 40 ° C Then stop vacuuming, add 5.6g of difunctional isocyanate MDI and 4.3g of IPDI, and stir rapidly. After the temperature is stable, slowly raise the temperature and control it at 75°C for 3 hours. After the reaction is complete, cool down to 40°C and add methyl Add 3.2g of hydroxyethyl acrylate and 2.5g of hydroxypropyl acrylate, add 0.04g of hydroquinone as a polymerization inhibitor, slowly raise the temperature to 70°C and react for 3 hours. Diene type polyurethane modified acrylate, sealed and protected from light for later use;

[0019] Accurately weigh 30g of the above-mentioned polybutadiene type polyurethane modified acrylate, 15g of isobornyl acrylate, 15g of tetrahydrofuran acrylate, 20g of N,N-dimethylacrylamide, 10g of lauryl acry...

Embodiment 3

[0020] Example 3, first take 213 g of hydroxyl-terminated polybutadiene diols with a molecular weight between 1500 and 4500 and an average functionality of 2, remove water at 115°C for 2 hours under vacuum conditions, and then cool it down to 50°C Then stop vacuuming, add 4.5g of difunctional isocyanate XDI, 6.9g of H-MDI and 14.5g of H-TDI, and stir rapidly. After the temperature is stable, slowly raise the temperature and control it at 85°C for 2 hours. After the reaction is complete, Cool down to 50°C, add 4.3g of hydroxyethyl acrylate, 2.5g of hydroxypropyl methacrylate and 5.7g of hydroxypropyl acrylate, and add 0.1g of hydroquinone as a polymerization inhibitor, slowly raise the temperature to 80°C for 2 hours, After the reaction is complete, vacuum degassing for 0.5h, take the material to obtain polybutadiene-type polyurethane-modified acrylate, seal and store away from light for later use;

[0021] Accurately weigh 65g of the above-mentioned polybutadiene type polyuret...

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Abstract

The invention discloses a light-curable adhesive with shock absorption property, which is characterized by comprising the following raw materials based on proportioning by weight: 25-70% of polybutadiene-based polyurethane modified polyacrylate oligomer, 25-70% of acrylic reactive diluent, 3-7% of light triggers and 0-10% of addition agents. The light-curable adhesive can improve the shock absorption properties of common light-curable adhesives, ensures that cured materials have excellent flexibility, is especially suitable for manufacturing high-quality electroacoustic components like buzzers, alarms, speakers, small speakers, micro speakers, receivers, microphones and the like, ensures that the electroacoustic products have good response curves under the conditions of high power and flat frequency so as to give out high-quality chord rings, and gives attentions to the requirements of modern multimedia products on tonal quality, frequency and size.

Description

Technical field: [0001] The invention relates to the technical field of adhesives, in particular to a light-curing adhesive with shock-absorbing properties, which is suitable for the manufacture of high-quality electroacoustic components, and is applied to the bonding of components and the fixing and reinforcement of leads. Background technique: [0002] Shock-absorbing adhesives are used in many places in electro-acoustic components, such as micro-speakers. A typical micro-speaker generally includes a sound film, a voice coil, a frame, a magnetic pole, a magnetic core, and a magnetic cylinder. All these small parts are glued together and assembled. A small micro-speaker is sometimes glued to as many as 8 places. Of all the bonding applications for microspeakers, the most important is the bonding of the diaphragm and voice coil. The adhesive currently used is generally solvent glue. The advantage of solvent glue is that the price is quite cheap, but it has the following di...

Claims

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Application Information

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IPC IPC(8): C09J175/14C09J9/00
Inventor 潘光君王建斌解海华
Owner YANTAI DARBOND TECH
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