Low-temperature fast curing underfill adhesive and preparation method thereof

An underfill, fast curing technology, used in chemical instruments and methods, adhesives, epoxy resins, etc., can solve the problems of slow curing speed, poor storage stability, high curing temperature of underfill, and achieve flow speed. The effect of fast, simple and environmentally friendly preparation process and low cost

Inactive Publication Date: 2009-11-18
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention mainly solves the problems of high curing temperature, slow curing speed and poor storage stability of the existing bottom filling glue.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Embodiment 1, take by weighing resin 828EL (shell) 13.2g, resin 830LVP (Dainippon Ink) 39.2g, colorant 0.5g (Degussa carbon black T4 and 828EL are mixed in proportion, specific weight ratio is 2: 8, mix color paste), curing agent fujicure fxr 1020 25g, accelerator PN-H (Ajinomoto) 5g, coupling agent KH560 0.56g, epoxy reactive diluent AGE (shell H8) 20g, curing agent is latent, The fineness is 5-10μ; bake the resin 830LVP at 70-75°C overnight, then mix the resin 828EL, resin 830LVP, and color paste evenly for 30 minutes at a temperature of 25°C, and then add the curing agent (in three additions), Accelerator, three-roll machine, mix evenly, temperature 25°C, mix under cooling and drying conditions, control cold water at 15°C, mix three times, mix well and add to the reaction kettle under full vacuum for 15min, when the resin and curing agent are mixed evenly, add Mix the coupling agent and epoxy diluent, and vacuum for 30 minutes to obtain the sample. It is measured tha...

Embodiment 2

[0019] Embodiment 2, take by weighing 25g of resin 828EL (shell), 40g of resin 830LVP (Dainippon Ink), 0.5g of colorant (Degussa carbon black T4 and 828EL are mixed in proportion, and the specific weight ratio is 2: 8, and the color paste is mixed ), curing agent fujicure fxr 1020 10g, curing agent PN23 10g produced by Ajinomoto, accelerator PN-H (Ajinomoto) 1g, coupling agent KH550 0.1g, epoxy reactive diluent (shellH8) 15g, The curing agent is latent, with a fineness of 5-10μ; bake the resin 830LVP at 70-75°C for one night, then mix the resin 828EL, resin 830LVP, and color paste evenly for 20 minutes at a temperature of 30°C, and then add it to cure Adding agent (in three times), accelerator, mixed evenly in a three-roll machine, temperature 20°C, mixed under cooling and drying conditions, cold water controlled at 15°C, mixed three times, mixed evenly, added to the reaction kettle under full vacuum for 15min, when the resin After mixing with curing agent evenly, add coupling...

Embodiment 3

[0020] Embodiment 3, take by weighing resin 828EL (shell) 20g, resin 830LVP (Dainippon Ink) 20g, colorant 0.5g (Degussa carbon black T4 and 830LVP are mixed in proportion, specific weight ratio is 2: 8, mix into color paste ), curing agent fujicure fxr 1020 and modified imidazole curing agent 2,4 dimethylimidazole 25g, accelerator PN-H (Japan Ajinomoto) 6g, coupling KH570 2g, coupling KH560 1g, epoxy reactive dilution The curing agent (shell H8) is 25g, the curing agent is latent, and the fineness is 5-10μ; bake the resin 830LVP at 70-75°C overnight, then mix the resin 828EL, resin 830LVP, and color paste evenly for 40 minutes. The temperature is 20°C, then add the curing agent (add in three times), the accelerator, and mix evenly with a three-roller machine. The temperature is 30°C, and mix under the condition of cooling and drying. Medium-full vacuum for 15 minutes, when the resin and curing agent are mixed evenly, add coupling agent and epoxy diluent and mix, and full-vacuu...

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Abstract

The invention discloses a low-temperature fast curing underfill adhesive, which is characterized by comprising the following raw materials by weight portion: 40 to 65 portions of resin, 0.5 portion of colorant, 20 to 25 portions of curing agent, 1 to 6 portions of accelerant, 0.1 to 3 portions of coupler and 15 to 25 portions of epoxy active diluents. The preparation method comprises the following steps: firstly, uniformly mixing the resin and color paste for 20 to 40 minutes at 20 to 30 DEG C; secondly, adding the curing agent and the accelerant by three times, uniformly mixing the materials with a three-roller at 20 to 30 DEG C under a condition of chilling drying with cooling water kept at 15 DEG C for 3 times, adding the uniformly mixed materials into a reaction kettle and completely vacuumizing the reaction kettle for 15 minutes; and finally, after the resin and the curing agent are mixed uniformly, adding the coupler and the epoxy active diluents, mixing the materials in the reaction kettle, and completely vacuumizing for 30 minutes to obtain the product. The product is low in curing temperature, high in curing speed and good in storage stability, simple, easy and environmentally-friendly in preparation process, low in cost and wide in application range.

Description

Technical field: [0001] The invention relates to the technical field of bottom filling, in particular to a low-temperature fast-curing bottom filling glue and a preparation method thereof. Background technique: [0002] Underfill technology originated from IBM in the 1970s, and has now become an important part of the electronics manufacturing industry. At first, the application range of this technology was limited to ceramic substrates. It was not until the industry transitioned from ceramic substrates to organic (stacked) substrates that underfill technology was applied on a large scale, and the use of organic underfill materials was established as an industry standard. Underfill systems in use today can be divided into three categories: capillary underfill, flux (no-flow) underfill, and four-corner or corner-point underfill systems. Each type of underfill system has its advantages and limitations, but by far the most widely used is the capillary underfill material. Appli...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J11/06C09J11/04C09J9/00C09K3/10
Inventor 周建忠王建斌解海华
Owner YANTAI DARBOND TECH
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