The invention discloses a high-reliability fast curing underfill adhesive, which is characterized by comprising the following raw materials by weight portion: 45 to 75 portions of resin, 20 to 25 portions of specially processed silicon powder, 0.5 portion of colorant, 20 to 25 portions of curing agent, 1 to 6 portions of curing accelerant, 0.1 to 3 portions of coupler, 10 to 15 portions of cycloaliphatic epoxy resin and 15 to 25 portions of epoxy active diluents. The preparation method of the high-reliability fast curing underfill adhesive comprises the following process steps: a, pretreatment, in which the resin is roasted for one night at 70 to 75 DEG C; and b, mixing, in which the resin, the cycloaliphatic epoxy resin and the coolant are first uniformly mixed and then added with by three times the specially processed silicon powder followed by the curing agent and the curing accelerant, the uniformly mixed materials are added into a reaction kettle, the reaction kettle is completely vacuumized for 15 minutes, the coupler and the epoxy active diluents are added after the resin and the curing agent are mixed uniformly, the reaction kettle is completely vacuumized for 30 minutes, and the product is obtained. The product has the advantages of low curing temperature, high curing speed, high flowing speed, excellent storage stability, simple, easy and environmentally-friendly preparation process, low cost and wide application range.