Composite magnetic body, its manufacturing method, circuit substrate using the same, and electronic device using the same
A composite magnetic body and manufacturing method technology, applied in the direction of magnetic objects, circuit substrate materials, inductance/transformer/magnet manufacturing, etc., can solve problems such as energy loss, difficulty in being used as circuit boards and electronic components, and reduced magnetic permeability of materials. Achieve the effect of low power consumption
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Embodiment 1
[0106] 1 g of 78-permalloy magnetic powder (Ni: 78%-Fe: 22% alloy) with an average particle size of 0.15 μm was mixed in the following dispersion liquid, which was mixed with xylene and cyclopentanone 4 : 1 mixed solution 10g dissolved nitrogen-containing graft polymer as a surfactant, and then added zirconia beads with an average particle diameter of 200 μm as a dispersion medium, and carried out planetary stirring for 30 minutes in this state, and magnetic The powder is made into a flat shape. 0.5 g of a resin varnish obtained by diluting a polycycloolefin resin to a solid ratio of 40% was added to the slurry obtained above, and the mixture was further stirred for 5 minutes with a walking star. Furthermore, zirconia beads were added as a dispersion medium, and mixed by planetary stirring for 5 minutes. The revolution speed during planetary stirring is 2000rpm, and the rotation speed is 800rpm.
[0107] Then, the resulting mixed solution was allowed to settle to settle the ...
Embodiment 2
[0109] Using 1 g of 45-permalloy magnetic powder (Ni: 45%-Fe: 55% alloy) with an average particle size of 0.15 μm, a composite magnetic body was produced under the same conditions as in Example 1 above to obtain an area of 30 mm square and a thickness of Composite magnetic body of 60μm. The complex magnetic permeability of this composite magnetic body is measured by the parallel line method, and the relative magnetic permeability μr=5, the magnetic loss tanδ=0.05 under 1GHz as a result (referring to image 3 ). Micrographs showing the structure of the composite magnetic body are shown in Figure 4 shown.
Embodiment 3
[0111] An example of applying the present composite magnetic body to a circuit board is given. First, six composite magnetic dry films having a thickness of about 60 μm obtained in the procedure shown in Example 1 were laminated and fired under pressure to produce a composite magnetic material with a thickness of about 350 μm. Furthermore, this composite magnetic material was sandwiched between low-dielectric-constant resin films, heated to harden the resin, and copper-plated on the resin surface to form a wiring pattern (microstrip line) with a length of 30 mm and a width of 0.9 mm. Figure 7 Shows the appearance of this circuit board. In addition, although Figure 8 It shows the transmission characteristics and reflection characteristics of this circuit board, but the actual measurement results are very consistent with the calculated values obtained by the electromagnetic field simulator HFSS, and it can be seen that the desired relative permeability and loss can be obtaine...
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