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Method for separating solder and detaching electronic elements from waste circuit boards

A technology for waste circuit boards and electronic components, applied in the field of waste recycling and reuse, can solve problems such as the lack of mature and effective theories and methods, and achieve the effect of solving trouble and avoiding waste.

Inactive Publication Date: 2009-12-02
杨继荣
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Problems solved by technology

However, so far, there is no treatment mechanism and relatively mature process equipment for waste electronic products in China.
Foreign scholars are also conducting hot research on this topic, but relatively mature and effective theories and methods have not yet been formed.

Method used

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Embodiment Construction

[0009] The following specifically introduces a method for separating solder and disassembling electronic components from discarded circuit boards, which includes the following steps:

[0010] 1. Dust removal: Use high-pressure gas to spray the waste circuit board in the closed device, use high-pressure gas to blow off the dust on the waste circuit, and filter the air in the closed device to remove dust;

[0011] 2. Hot air heating: The LZ industrial hot air blower produced by Guangzhou Longzheng Electromechanical Equipment Co., Ltd. is used to heat the component-free surface of the discarded circuit board with hot air. The power of the hot air blower is 3-100kw, and the maximum air volume is 75m 3 / min, the outlet temperature is from room temperature to 350°C, which is higher than the melting point of solder at 231.9°C, which meets the melting requirements for circuit board solder;

[0012] 3. Vibration: Select the model ACH-06020D low-power AC servo motor as the motor of the ...

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Abstract

The invention relates to a method for separating solder and detaching electronic elements from waste circuit boards, which comprises the following steps: in an enclosed device, firstly conveying the waste circuit boards to an appointed position; then starting a heating device, heating the circuit boards in a hot air heating mode of a warm-air pipe with annular pinholes, melting soldering tin on welding spots to remove the soldering tin; at the time of starting the heating device, starting a vibration device to make the electronic elements vibrate, fall off from the circuit boards and fall into a collection box; and finally, withdrawing the circuit boards and recovering the electronic elements. The method can make the electronic elements on the circuit boards quickly and integrally separated from the circuit boards and fall off; and then the electronic elements are screened and detected, and perfect and effective electronic elements and partial noble metal materials are obtained; therefore, the invention not only finds a way for recycling the large quantity of waste circuit boards in China to avoid resource waste and change waste into treasure, but also finds a good method for processing the waste circuit boards to solve the problems of troubles and environmental pollution caused by destroying the waste circuit boards.

Description

【Technical field】 [0001] The invention relates to a method for separating solder and dismantling electronic components from waste circuit boards and recovering part of precious metal materials, which belongs to the technical field of waste recycling. 【Background technique】 [0002] The ever-increasing waste of mechanical and electrical products is the key to seriously affecting the human environment and resources, and it has become an important obstacle to circular economy and sustainable development. However, so far, there is no treatment mechanism and relatively mature process equipment for waste electronic products in China. Foreign scholars are also conducting hot research on this, but relatively mature and effective theories and methods have not yet been formed. Therefore, there is an urgent need for recycling theory and technology to guide and standardize it. In particular, it is urgent to propose a more reasonable disassembly process for typical electronic products a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/018B07B15/00B09B3/00
CPCY02W30/82
Inventor 杨继荣
Owner 杨继荣
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