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Conductive paste constituent

A technology of composition and conductive paste, which is applied in the direction of metal/alloy conductors, printed circuit parts, metal pattern materials, etc., and can solve problems such as disconnection or segregation

Inactive Publication Date: 2013-01-16
KYOTO ELEX
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, if a circuit or an electrode is formed using a conductive paste with silver powder as a conductor, the silver will diffuse into the substrate or green sheet, causing problems such as disconnection or segregation.

Method used

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  • Conductive paste constituent
  • Conductive paste constituent
  • Conductive paste constituent

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Embodiment

[0036] Embodiments of the present invention will be described below, but the present invention is not limited to the following embodiments, and the present invention can be appropriately changed and corrected within the range not departing from the technical idea of ​​the present invention.

[0037]As shown in the following table 1, the atomized powder of the alloy (Ag 97% by weight, Ni 3% by weight) of Ag and Ni alloy (Ag 97% by weight, Ni 3% by weight) with an average particle size of 75 to 80% by weight of 5 μm (utilized nitrogen atomized powder), 0.1-15.0% by weight of copper-containing substance in terms of copper, and 10.0-19.9% ​​by weight of an organic vehicle obtained by dissolving ethyl cellulose resin in terpineol to obtain a conductive paste.

[0038] Also, for comparison, as shown in Table 2 below, 80% by weight of the above-mentioned Ag and Ni alloy atomized powder was mixed with 20% by weight of the above-mentioned organic excipient with a three-roll mill, or 80...

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PUM

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Abstract

The present invention provides a low-resistance conductive paste composition, which contains heat-resistant conductors without the need of using high-priced precious Ag and Pt or Pd alloys or intentionally forming heat-resistant metal layer on the Ag powder surfaces . In the conductive paste composition, Cu-containing substance is added into the atomized AgNi alloy powders for use as the conductive component.

Description

technical field [0001] The present invention relates to a conductive paste composition, and in particular, to a heat-resistant conductive paste composition that can be fired at a high temperature of 950°C to 1200°C. Background technique [0002] Conductive pastes are often used as means for forming conductive circuits and electrodes of various substrates that form electronic circuits and laminated electronic components. [0003] Conductive paste is usually a paste composition formed by dispersing metal conductor powder as a conductive component in an organic vehicle composed of a resin binder and a solvent, and is printed or coated on a ceramic substrate or a ceramic green sheet, etc. After above, the above-mentioned organic excipient is evaporated and decomposed by a firing method, and the remaining conductive components form a sintered body to form a good conductor, and the sintered body of the conductive component forms a conductive circuit or an electrode. In actual use...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/02H05K1/09
Inventor 越智博尾本义和高木一也
Owner KYOTO ELEX