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Multilayer circuit board and motor drive circuit board

A technology of multi-layer circuit substrates and circuit parts, which is applied in multi-layer circuit manufacturing, electric steering mechanism, circuits, etc., can solve the problems of high cost and easy to be cut off, and achieve the effect of good thermal conductivity

Inactive Publication Date: 2012-03-07
JTEKT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, ceramic multilayer substrates have a problem of very high cost
In addition, since the ceramic multilayer substrate is easily cut, there is another problem that it is necessary to use methods other than screw fixing when fixing it into the ECU.

Method used

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  • Multilayer circuit board and motor drive circuit board
  • Multilayer circuit board and motor drive circuit board
  • Multilayer circuit board and motor drive circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0042] (Embodiment of the present invention)

[0043] figure 1 It is a cross-sectional view of a multilayer circuit board according to an embodiment of the present invention. figure 1 The illustrated multilayer circuit board includes a laminated circuit portion 13 in which conductive layers 11 and insulating layers 12 are alternately laminated, and a metal substrate 14 . The conductor layer 11 is formed of metal, and the insulating layer 12 is formed of a composite (so-called prepreg) in which glass fibers are impregnated with an insulating resin material. The conductor layer 11 is preferably formed of a metal having good thermal conductivity, and the insulating layer 12 is preferably formed of a resin having a thermal conductivity of 1 W / m·K or higher. In the following description, the conductor layer 11 is formed of copper, and the insulating layer 12 is formed of a composite of glass fiber and epoxy resin.

[0044] The laminated circuit portion 13 is formed by thermall...

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PUM

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Abstract

A multilayer circuit part (13) is fabricated by alternately forming a conductor layer (11) and a resin insulating layer (12). A metal sheet (14) is provided in contact with the lowermost insulating layer (12). The conductor layers (11), the insulating layers (12), and the metal sheet (14) are joined by thermo-compression. A heat-dissipating via (21) used for connecting the uppermost conductor layer (11) on which an electronic component (31) is mounted to the lowermost insulating layer (12), having a conductor layer (22) formed by cupper plating on the inner surface and filled with resin (23).The uppermost conductor layer (11) is plated with nickel as a base layer and then gold (15) thereon. When an electronic component (31) for driving a motor is mounted on the uppermost conductor layer (11), the circuit board can be used as a motor drive circuit board for electric power steering systems.

Description

technical field [0001] The present invention relates to a multilayer circuit substrate and a motor drive circuit substrate for an electric power steering system using the multilayer circuit substrate. Background technique [0002] The vehicle electric power steering system drives a steering assist motor in accordance with the steering torque applied to the steering wheel by the driver, the speed of the vehicle, etc., so that an appropriate steering assist force can be obtained. The steering assist motor is driven by a motor drive circuit built in an electronic control unit (hereinafter referred to as ECU). The motor drive circuit controls a large electric power of about 500W to 2000W when driving the steering assist motor. [0003] At this time, the motor drive circuit generates heat, and the motor drive circuit is mounted on a circuit board having good thermal conductivity in order to prevent malfunction and malfunction of the ECU caused by the heat. For example Figure 7...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46B62D5/04
CPCH05K3/429H05K2201/0959H05K1/0206H05K2201/09527H01L2224/48091H01L2224/73265H05K3/4611H05K2201/0394H05K2201/09518H01L2224/48227H05K3/0061H01L2224/32225H05K3/244H05K2201/0347H01L2224/45124H01L2924/00014H01L2924/00
Inventor 中井基生长濑茂树
Owner JTEKT CORP
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