Substrate cleaning apparatus, substrate cleaning method, and storage medium

A technology for cleaning devices and substrates, applied in cleaning methods and tools, cleaning methods using tools, cleaning methods using liquids, etc., can solve problems such as inability to remove attachments, achieve effective cleaning, increase hardness, and improve cleaning power Effect

Active Publication Date: 2009-12-23
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, on the periphery of the substrate, especially on the end surface of the substrate, there are deposits firmly attached, and the deposits may not be removed only by touching a sponge-like brush.

Method used

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  • Substrate cleaning apparatus, substrate cleaning method, and storage medium
  • Substrate cleaning apparatus, substrate cleaning method, and storage medium
  • Substrate cleaning apparatus, substrate cleaning method, and storage medium

Examples

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no. 1 Embodiment approach

[0059] A first embodiment of the present invention will be specifically described below with reference to the drawings. figure 1 It is a schematic diagram showing the structure of the wafer cleaning apparatus according to the first embodiment of the present invention. figure 2 is a floor plan showing its interior.

[0060] The wafer cleaning device 1 has a chamber 2 . The chamber 2 is provided with a spin chuck 3 for suctioning and holding a semiconductor wafer (hereinafter simply referred to as a wafer) W serving as a substrate to be cleaned in a horizontal state by vacuum suction. A motor 4 provided below the chamber 2 can rotate the spin chuck 3 via a shaft 3 a. In addition, a cover 5 is provided in the chamber 2 so as to cover the wafer W held on the spin chuck 3 . At the bottom of the cover 5 , an exhaust and liquid discharge pipe 6 for exhausting and liquid discharge is provided so as to extend downward of the chamber 2 . In the side wall of the chamber 2, a loading...

no. 2 Embodiment

[0081] next reference Figure 11 to Figure 13 A second embodiment of the present invention will be described. In the 2nd embodiment, with Figure 1 to Figure 10 The parts that are the same as those in the first embodiment shown are assigned the same symbols, and detailed descriptions thereof will be omitted.

[0082] In this example, Figure 5 The function of controlling the cleaning of the wafer W by changing the compressive force against the brush 21 and controlling the cleaning of the wafer W by the control unit 30 shown in . That is, based on the processing plan stored in the storage unit 63, the controller 61 sends a command to the air cylinder 24 to change the compressive force of the pressing members 23a and 23b on the brush 21 to control cleaning of the wafer W. Specifically, it is possible to control the cleaning of the wafer W by changing the compressive force of the brush in real time during cleaning. Alternatively, it is possible to obtain information on the st...

no. 3 Embodiment

[0097] next reference Figure 14 to Figure 20 A third embodiment of the present invention will be described. In the 3rd embodiment, with Figure 1 to Figure 10 The parts that are the same as those in the first embodiment shown are assigned the same symbols, and detailed descriptions thereof will be omitted.

[0098] like Figure 14 As shown, the cleaning mechanism 20 has a brush 21 formed of a spongy resin for cleaning the peripheral portion including the end surface of the wafer W, a rotation support member 22 that supports the brush 21 in a rotatable manner, and a brush holding mechanism that holds the brush 21 ( brush compression mechanism) 23, a cylinder 24 for applying a holding force for holding the brush 21 or a compressive force for compressing the brush 21, a rotating arm 25 for rotating the brush 21, and a built-in shaft portion 26 used as a rotating shaft of the rotating arm 25 , and a rotating lifter 27 built in a rotating mechanism that rotates the rotating arm...

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PUM

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Abstract

The invention relates to a substrate cleaning apparatus, a substrate cleaning method and a storage medium. A substrate cleaning apparatus capable of effectively removing deposits adhering to at least an end surface of a substrate by means of a sponge-like brush is provided. A substrate cleaning apparatus includes: a spin chuck 3 configured to rotatably hold a substrate W; a motor 4 configured to rotate the substrate W held by the spin chuck 3; a cleaning-liquid supply mechanism 10 configured to supply a cleaning liquid to the substrate W held by the spin chuck 3. The cleaning mechanism includes: a brush 21 made of a sponge-like resin, which is brought into contact with at least an end surface of the wafer W during the cleaning; and a brush compressing mechanism 23a, 23b, and 24 configured to compress the brush 21. The brush 21 is compressed by the compressing mechanism 23a, 23b, and 24, and cleans at least the end surface of the substrate W.

Description

technical field [0001] The present invention relates to a substrate cleaning device, a substrate cleaning method, and a storage medium for cleaning at least an end surface of a substrate. Background technique [0002] In a manufacturing process of a semiconductor device and a manufacturing process of a flat panel display (FPD), a cleaning process is performed to remove particles or contaminants etc. attached to a substrate to be processed such as a semiconductor wafer or a glass substrate. As an apparatus for performing such a cleaning process, there is known a single-leaf type cleaning apparatus that holds a substrate on a spin chuck and supplies a cleaning liquid to the surface of the wafer while the substrate is being rotated for cleaning. the surface of the wafer. [0003] In the cleaning process of this cleaning device, the acid or alkali chemical solution used as the cleaning liquid remains on the peripheral part of the substrate during the cleaning process, and they ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00B08B3/08B08B1/04
Inventor 毛利信彦田中晓
Owner TOKYO ELECTRON LTD
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