Resin prepreg constitutive rubber solution and heat dissipation rubber piece and manufacturing method thereof

Abstract

The invention relates to hardening agent resin prepreg rubber solution and heat dissipation rubber pieces and a manufacturing method thereof. The main structural components of the hardening agent are shown as the formula (I), and the addition of the hardening agent enables the heat dissipation rubber piece to possess both heat resistance and adhesiveness. Since the structure of the hardening agent has polarity, inorganic powder can be uniformly dispersed in the resin prepreg composition rubber solution, thus the heat dissipation rubber piece manufactured by being dipped in the resin prepreg constitutive rubber solution has better resin characteristics and heat conduction efficiency.

Description

technical field [0001] The invention relates to a curing agent, resin prepreg composition glue, heat dissipation film and a manufacturing method thereof, in particular to a hardener with high thermal conductivity, resin prepreg composition glue, heat dissipation film and a manufacturing method thereof. Background technique [0002] At present, circuit boards are used in a wide range of levels and fields. Generally, electronic components in electronic products are inserted into circuit boards. In order to meet the application range of high-power and high-heat components, current circuit boards are placed in the circuit board. Development and research are carried out on the heat dissipation effect to improve the heat dissipation efficiency and high power of the circuit board. [0003] In the traditional circuit board structure, due to the low number of electronic components inserted on it and the low power consumption, most of the heat generated by the electronic components ca...

AI Technical Summary

Problems solved by technology

However, in order to improve the heat dissipation function of the heat dissipation thin film, the glue composition of the epoxy resin prepreg uses a large amount of inorganic heat dissipation filler powder, so the amount of crosslinking resin component in the relative unit will be greatly reduced, so that all Part of the resin properties of the heat-dissipating thin film formed by impregnation is degraded. For example, the heat-resistance of the heat-dissipating thin film made of epoxy resin prepreg composed of a dicyanamide hardener is reduced, and the problem of cracking is likely to occur. ; On the other hand, the adhesion ability of the heat-dissipating thin film made of the epoxy resin prepreg composed of novolac epoxy hardener is reduced, so the epoxy resin prepreg with more hardener content is added to form the glue The toughness of the heat-dissipating thin film will be reduced. On the contrary, if the addition is insufficient, the heat-dissipating thin film will be difficult to cure. That is, the above-mentioned hardener may cause the heat-dissipating thin film to produce explosive plates or poor adhesion. Therefore, it is not suitable Suitable for the production of heat dissipation thin film

Images