Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Resonator and bandpass filter

A technology of resonators and resonant capacitors, applied in resonators, waveguide devices, impedance networks, etc., can solve problems such as increased system costs, inability to achieve miniaturization, and space occupation

Inactive Publication Date: 2009-12-30
SHENZHEN INST OF ADVANCED TECH
View PDF0 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional embedding technology needs to embed capacitors and inductors in the corresponding organic substrates, and the additional organic substrate layer will increase the system cost; and it will also occupy a certain space, which cannot achieve a good miniaturization effect.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resonator and bandpass filter
  • Resonator and bandpass filter
  • Resonator and bandpass filter

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] The inductor and capacitor are integrated to form a resonant circuit, and the resonant circuit is embedded in the printed circuit board in the same way as the traditional embedded capacitor technology. The inductor and capacitor can be integrated into an organic substrate layer at the same time, without additional organic components. The substrate layer is used to accommodate the inductor, which effectively achieves the purpose of miniaturization.

[0019] figure 1 The simplest form of a resonant circuit consists of a capacitor and an inductor connected in parallel.

[0020] like image 3 shown, based on figure 1 Top view of the constructed resonator. The inductance 1 is a planar spiral structure, which is formed by multiple bends of metal strips and separated by a certain distance, and the dielectric layer 2 is underneath it.

[0021] like Figure 4 Shown is a cross-sectional view of the resonator. It includes a planar spiral inductor 1 formed by metal strip trac...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a resonator and a bandpass filter, belonging to the field of an electric device. The resonator comprises a capacitor and an inductor which form parallel connection; the capacitor has a large-area flat plate-type embedded type capacitor structure for adding a dielectric layer in metal layers as polar plates; the inductor has a planar structure, and is used as a polar plane of the capacitor; and one end of the inductor is led out and is connected with an external circuit and the other end thereof is connected with the other polar plane of the capacitor. The bandpass filter is formed by coupling an external capacitor or an external inductor with at least two resonators. The resonator forms a resonance circuit by integrating the inductor and capacitor; a method which is same with the traditional embedded type capacitance technology is used for embedding the resonance circuit into a printing circuit board, so the inductor and the capacitor can be simultaneously integrated into an organic base plate layer, and an additional organic base plate layer is not needed to contain the inductor, thus achieving the purpose of miniaturization.

Description

【Technical field】 [0001] The invention relates to an electrical device, in particular to a resonator and a band-pass filter. 【Background technique】 [0002] With the development of electronic products in the direction of miniaturization, high density, and multi-function, the number of various components and interconnection lines in electronic products is gradually increasing, and the physical size of the components and interconnection lines is also getting smaller and smaller. Therefore, the system-in-package technology that integrates electronic systems composed of various active and passive components into a common package has become an important trend in the future. [0003] Many printed circuit boards have resonant circuits, and use resonant circuits to form bandpass filters. A resonant circuit is generally formed by connecting a capacitor and an inductor in parallel. In a high-density printed circuit board, the number of inductors and capacitors is huge, and how to in...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01P7/00H01P1/20H03H1/00H03H7/01
Inventor 王云峰李磊刘小利
Owner SHENZHEN INST OF ADVANCED TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com