Printed circuit board as well as manufacture method and associated equipment thereof

Abstract

The embodiment of the invention relates to a printed circuit board and discloses a printed circuit board as well as a manufacture method and associated equipment thereof. The associated equipment comprises a device for solving the reflux of a radio-frequency power amplifier and communication equipment. The printed circuit board comprises a plurality of monolayer printed circuit boards, and the first surface of the printed circuit board is attached with a surface copper sheet; one reference monolayer printed circuit board of the printed circuit board is attached with a reference copper sheet which corresponds to the surface copper sheet and is different from the monolayer printed circuit board attached on the surface copper sheet; the printed circuit board comprises a window, and the side wall of the window is attached to side wall metal; and the side wall metal is electrically connected with the reference copper sheet and insulated with the surface copper sheet. The technical scheme does not need the complicated processing procedure of the printed circuit board when the problem of the reflux is solved.

Description

technical field [0001] The invention relates to a printed circuit board, in particular to a printed circuit board, a manufacturing method thereof, and related equipment, wherein the related equipment is a device for solving the backflow of a radio frequency power amplifier and communication equipment. Background technique [0002] With the miniaturization and low-cost requirements of printed circuit board (PCB: Printed Circuit Board) products becoming more and more urgent, the common board design of base station boards including power amplifiers has become an important development trend in the industry's product realization forms; including power amplifiers, radio frequency The common-board printed circuit board design including circuits, digital, power and other circuits is designed by multi-layer stacking. When designing an RF power amplifier on a single board of a multi-layer printed circuit board, it is necessary to consider the reasonableness of the matching circuit of t...

AI Technical Summary

Problems solved by technology

[0004] In the process of realizing the present invention, the inventor found that the above-mentioned technical solution has at least the following defects: due to the need for mechanical blind holes and plugged holes, it is necessary to perform at least two press-fits and two Drilling, two hole wall metallization, and one plugging process lead to complicated processing procedures and high costs for printed circuit boards

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